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QSFP-DD Interconnect System
A 76-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 400Gb/s in aggregate over an 8 x 50Gb/s electrical interface.
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High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology.
The 2024 OCP Global Summit, scheduled for October 15-17 in San Jose, California, is poised to be a landmark event in the Open Compute community. Under the theme "From Ideas to Impact," the summit will bring together industry leaders, researchers, and innovators.
COM-HPC, or Computer-on-Module for High-Performance Computing, is an open standard for integrating advanced computing capabilities into compact modules.