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Focus Products
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DIN 41612 Headers and ReceptaclesFCI Basics DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability.
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Minitek® Pwr 3.0 High Current ConnectorMinitek® Pwr 3.0 High Current Connector (HCC) is designed for power applications with current rating up to 12A per contact and wire gauge range from 30 to 16AWG for Wire-to-Wire and Wire-to-Board applications. It is available in 2 to 24 circuits for dual row and 2 to 12 circuits for single row.
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Mini Cool Edge IOAmphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4/PCIe® Gen 4/PCIe® Gen 5,
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Mini-SAS HD Active Optical CableAmphenol's Mini-SAS HD Active Optical Cable is fully compliant to SAS 2.1 and SAS 3.0 industry standards as well as the SFF-8636 interface standard. Used primarily for external Enterprise storage applications (box-to-box, server to storage, server to switch), this cable is part of Amphenol's comprehensive Mini-SAS HD product offerings that address all board connector and cabling applications, from 1 to 100 meters.
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Paladin® HD 112G Backplane Interconnect SystemThe Paladin® HD interconnect system provides world class bandwidth through industry leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing.
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InfinX®The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX is your best choice for high speed board-to-board applications.
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XCede® HD2While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.
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OCP 48V BarKlip® BK500 IOAmphenol's OCP 48V compliant Barklip® BK500 power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards.
New Products
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OCP ORv3 AC Input Connector and Cable AssembliesAmphenol's OCP-compliant AC Input Connectors and Cable Assemblies are designed to meet OCP's V3 Universal Input power distribution architecture standards and provide a convenient method of routing power directly from the busway to the power shelf within the V3 rack.
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SAS/PCIe 5.0 (U.2 & U.3) ConnectorsSAS/PCIe 5.0 (U.2 & U.3) connectors comes with 32GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers. The 68-position, SAS/PCIe receptacle and header enables implementation of high speed Serial Attached SCSI (SAS) hard disk drive (HDD) interface as well as Peripheral Component Express (PCIe)-based devices.
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0.50mm Power Pin Floating Board-to-BoardPower pin 0.50mm pitch floating board-to-board connector system is designed for applications that need large current and space saving.
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BergStak® Secure ConnectorThe BergStak® Secure connector family contains one-time-use and multi-times-use solutions to support customers' different needs on connection security. The family now contains variants with 3-row and 4-row contacts with 37 columns per row, and it can be extended in both (10)row and (100)column direction based on customer requirements, to fulfill high pin count/high signal density requirements.
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WTB BMI Fan ConnectorsAmphenol's wire-to-board fan connectors come with Blind-Mate Interface. The 1.25mm pitch wire-to-board connectors meet a maximum of 2.8A/pin current carrying capacity, whereas the 2.00mm pitch wire-to-board connectors meet a maximum of 5.3A/pin and the 2.54mm pitch wire-to-board connectors meet a current-carrying capacity of maximum 5.5A/pin.
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ExaMAX2® Cable AssemblyExaMAX2® Cable Backplane Systems offer high density cable assemblies for both internal and external applications that are capable of delivering high speed performance of 112Gb/s per channel.
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SFP OverPass™ AssembliesSFP OverPass™ products remove high speed signaling from the PCB and create a direct connection between the ASIC site and the external IO port by overpassing the PCB.
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ExtremePort™ QSFP 112GAmphenol's ExtremePort™ QSFP 112G interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications.