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Discover our new cutting-edge connector solutions providing enhanced efficiency, reliability, and speed, transforming how you experience connectivity in your designs

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112G PAM4 Mini Cool Edge 0.60mm Card Edge Connectors

Mini Cool Edge is a 0.60mm high-density, high-speed card edge connector for new-generation small form factor systems. The fine-pitch solutions in vertical orientation are now available for a complete interconnect solution.

FlexFast™ Mini Flex-to-Board

FlexFast™ Mini Flex-to-Board connector's compact design addresses the growing demand for the automotive applications market. The connector is designed to be compliant with USCAR and LV-214 specifications.

HD Express®

The HD Express® is a high-density, high-performance interconnect system designed to meet and exceed PCIe® Gen 6 electrical and mechanical requirements for high-end 85Ω architectures.

ExtremePort™ OSFP 224G Connectors

Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications.

Mini Cool Edge IO

Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 64G PAM4/PCIe® Gen 4/PCIe® Gen 5/PCIe® Gen 6

Dubox® 2.54mm Crimp to Wire

The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact.

Paladin® HD 224Gb/s Backplane Interconnect System

The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing.

UltraPass™ OverPass™ Assemblies

UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market.

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PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets

The PCI-SIG is making waves with its latest offering in computing standards with the PCI Express® Gen 7.0 which specifies a data rate of 128GT/s. This is double of the previous PCI Express® Gen 6 which had a data rate of 64GT/s.

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Amphenol Partners with Keysight and MultiLane for Demos

Amphenol is partnering with Keysight and MultiLane at DesignCon 2025 to showcase cutting-edge technology at their respective booths this year. We are excited to invite you to attend them and interact with our experts.

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Leading the Evolution of High-Speed Interconnect - DesignCon 2025

Amphenol is excited to invite you to the 30th DesignCon, a premier event in the tech industry that will take place from January 28th to 30th, 2025, at the Santa Clara Convention Center in California.

Dsub Connectors and Cables

The D-sub connector interface is popular for input-output applications in Telecommunications, Data centers, Consumer, Industrial, Military, Instrumentation, and Medical markets.

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CUSTOM INTERCONNECT SOLUTIONS, GLOBAL MANUFACTURING FOOTPRINT

Custom

Our engineering teams collaborate with our customers on 1000’s of projects every year, so no matter what technical, operational and even commercial challenges you face, Amphenol CS can develop a solution for you!

Plating

Our engineering teams have built a solid reputation with our customers, partnering with them every step of the way from concept and design to prototype and final production, in order to fulfill your custom requirements.

Expertise

Amphenol CS brings a broad array of innovative technology and solutions to support the growth of Information, Communications and Commercial electronics markets, particularly in plating, signal integrity performance, and power management.

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