Get your sample by choosing part number(s) from the product page or using the search box above.Manually add part number(s) here
Open Compute Project
Amphenol provides high-speed connectors, card edge connectors, power busbar connectors, and cable solutions for many OCP projects, allowing for standardized solutions and simple system designs.
PCI Express® Flip CEM Card Edge Connectors
The PCIe® Gen 5 Flip CEM is a new 1.0mm pitch vertical card edge connector that follows PCIe® standard mating interface. It is designed with a different footprint because the contacts are “JJ” type or “LL” contacts which provide maximum savings of up to 19.5% in keepout area. The current Flip CEM supports 32GT/s (Gen 5) and the mating side supports backward compatibility with PCIe® 4/3/2/1 card.
DuraEV™ is a standard connector solution offered with 2 power and 4/6 signal pins which employs a patented contact system that is capable of carrying a continuous current from 15A up to 70A with 10,000 mating cycles.
BergStak® 0.635mm Connector
BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection.
ExtremePort™ QSFP 112G
Amphenol's ExtremePort™ QSFP 112G interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels which increases port density, frees up board real estate and delivers a cost optimized solution. The ExtremePort™ QSFP 112G connector supports next generation 400G applications and transmits up to 112Gb/s PAM4 per channel.
BarKlip® BK200 I/O for EV Charging
Amphenol's BarKlip® BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
Single Pair Ethernet (SPE) IP67 Circular Push-Pull Connectors and Cables
Single Pair Ethernet (SPE) connectors for Industrial applications bring direct Ethernet connectivity to peripheral devices like sensors, actuators, and vision system cameras that operate at speeds up to 1Gb/s. SPE eliminates slow expensive and complex fieldbus protocols and connections by simplifying and standardizing existing and new industrial network systems.
QSFP DD Cable Assemblies
Amphenol's QSFP DD (Double Density) passive copper cable assemblies double the number of channels from 4 to 8 lanes when compared to the existing 100G QSFP cabling systems, enabling more bandwidth within the same mechanical envelope. Compatible with 25G/Lane NRZ up to 112G/Lane PAM4 signaling protocols that allow cables to deliver aggregate bandwidths of 200G, 400G, and 800G per cable assembly. Available in both Passive, Active and Loopback variants.
OSFP OverPass™ Assemblies
OSFP OverPass™ products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external OSFP IO port by overpassing the PCB. This helps to enable 56G and 112G hardware system designs and a technology for future 224G systems. Using these solutions results in lower over signal loss, less PCB design complexity and reduces PCB costs. Fully compatible with OSFP industry standards and with both high speed and sideband signal requirements.
e-MobilityAmphenol provides a broad array of compact, robust,
leading-edge interconnect solutions.
The global forklift market is being projected to grow at a CAGR of 13.2% from 2023 to 2030. The demand for forklifts has raised due to the growing e-commerce industry and evolving warehouse management practices that require handling heavy loads and navigating through narrow spaces.
From smart commutation to intelligent buildings and streets, everything we see today is equipped with the most advanced sensors. Zettabytes of data are being transferred in microseconds to establish communication channels between various sources within a smart city. With the introduction of the Internet of Things and the involvement of Artificial Intelligence, technological advancements are galloping to the next level making the world look more like a sci-fi movie.
OFC is the most comprehensive and largest conference and exhibition for optical communications and networking. It is the go-to place to visit and interact with hundreds of manufacturers on their latest products and innovative solutions and to understand on the trends that drive the market.
INDUSTRY TRENDSPCIe® Gen 6 High Speed Interconnect SolutionsPCIe 6.0 doubles bandwidth and power efficiency over PCIe 5.0 (32 GT/s), while meeting industry demand for high-speed, low-latency interconnects. Data Center, AI/ML, HPC, Automotive, IoT, and Military/Aerospace markets benefit from PCIe 6.0 technology’s cost-effective and scalable interconnect solution.