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QSFP-DD Interconnect System

A 76-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 400Gb/s in aggregate over an 8 x 50Gb/s electrical interface.

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QSFP-DD Interconnect System QSFP-DD Interconnect System
DDR5/LPDDR5 CAMM2 Connector
The DDR5/LPDDR5 CAMM2 connector follows JEDEC standards with 644 pins, has a pitch of 1.00x1.38mm, and a connector height of 1.0mm. It provides support for dual channel memory capacity of up to 128GB.
DDR5/LPDDR5 CAMM2 Connector
BarKlip® BK600 I/O
Amphenol's BarKlip® BK600 I/O power cable assemblies feature an OCP-compatible design compliant with ORv3 power distribution architecture standards. Barklip® BK600 I/O can distribute up to 700A between busbars, cables, and circuit boards.
BarKlip BK600 I/O
OSFP-XD Copper Cable Assemblies
Amphenol is at the forefront of OSFP-XD (Octal Small Form Factor Pluggable eXtra Dense) cable development, setting new industry standards with our innovative designs. Our advanced OSFP-XD cable assemblies are designed to meet the rigorous demands of both PCIe® Gen 5 and Ethernet protocols, providing a future-proof solution with unparalleled bandwidth capabilities.
OSFP-XD Copper Cable Assemblies
ExtremePort™ OSFP 224G Connectors
Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications.
ExtremePort OSFP 224G

  • Automotive Solutions

    The future of automotive interconnect
    engineering is here, and it's more compact,
    robust, and high-performing than ever.
    Discover automotive-grade solutions that excel in both performance and durability.
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    Automotive Solutions Automotive Solutions
Connect Blog
Next-Gen Data Centers and AI Applications
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Solving Cooling Interconnects for Next-Gen Data Centers and AI Applications
High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology.
Amphenol @ 2024 OCP Global Summit
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Amphenol @ 2024 OCP Global Summit
The 2024 OCP Global Summit, scheduled for October 15-17 in San Jose, California, is poised to be a landmark event in the Open Compute community. Under the theme "From Ideas to Impact," the summit will bring together industry leaders, researchers, and innovators.
Amphenol’s High-Performance COM-HPC Connectors
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Amphenol’s High-Performance COM-HPC Connectors
COM-HPC, or Computer-on-Module for High-Performance Computing, is an open standard for integrating advanced computing capabilities into compact modules.
  • Wire-to-Wire Connectors
    Wire-to-wire connections are becoming more popular because they enable modular system architectures and support fast and reliable assembly and installation. Learn more
    Wire-to-Wire Connectors

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Global

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CUSTOM INTERCONNECT SOLUTIONS, GLOBAL MANUFACTURING FOOTPRINT

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Custom

Our engineering teams collaborate with our customers on 1000’s of projects every year, so no matter what technical, operational and even commercial challenges you face, Amphenol CS can develop a solution for you!

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Our engineering teams have built a solid reputation with our customers, partnering with them every step of the way from concept and design to prototype and final production, in order to fulfill your custom requirements.

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Expertise

Amphenol CS brings a broad array of innovative technology and solutions to support the growth of Information, Communications and Commercial electronics markets, particularly in plating, signal integrity performance, and power management.

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