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Amphenol provides robust, reliable, high-performing interconnects, including sealed and unsealed versions, to accommodate the specific needs of each ADAS application.

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OCP 48V BarKlip^® BK500 IO

Amphenol's OCP 48V compliant Barklip® BK500 IO power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards. The connector system features two individual power circuits and two newly added secondary chassis grounding contacts.

ComboStak^® 0.50mm & PowerStak^® 2.00mm Board-to-Board Connector

The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.

PCI Express^® DirectAttached™ CEM Card Edge Connectors

Amphenol's 1.0mm pitch DirectAttached™ CEM (DA CEM) is a hybrid card edge solution with high-speed signal pins designed to directly attach to the cable to eliminate PCB trace loss and press-fit termination type power pins for better rework.

SK Series - Sockets

Amphenol's patented compression mount contact technology utilizes industry-leading alloys to make cost effective and electrically robust socket solutions that offer high performance. With designs supporting pitches down to 0.4mm and speeds up to 40GHz, the SK series sockets are being used in cutting edge BGA, LGA and other small form factor IC applications.

Mini Cool Edge 0.60mm Connectors

Mini Cool Edge is a 0.60mm high density, high speed card edge connector for new generation small form factor system. This fine pitch solution offers multiple BTB applications like right angle, mezzanine and coplanar and support cable interconnect options.

MicroSpaceXS™ 1.27mm Unsealed Crimp-to-Wire/Wire-to-Wire Connector

MicroSpaceXS™ Crimp-to-Wire Connector Platform's unique design meets LV214 Severity-2 and USCAR-T2V2 specifications. These 1.27mm pitch connectors come with a current rating up to 4A per contact making them ideal for higher power applications. MicroSpaceXS™ connectors are available in staggered pin configuration in vertical and horizontal orientations and in Wire-to-Board and Wire-to-Wire configurations.

XCede^® HD2

DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.

Paladin^® 112Gb/s Backplane Cable

Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next generation system architectures. Our customers are leading providers of datacenter switches and routers, enterprise servers and high performance computers.

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Amphenol at the 2023 ECOC Exhibition: Catch a Glimpse of Cutting-Edge Connectivity Solutions

The much-anticipated ECOC Exhibition 2023 is just around the corner, and with an impressive lineup of state-of-the-art connectivity solutions, Amphenol will be there for you at Booth #412 from October 2nd to October 4th at the Scottish Event Campus in Glasgow, Scotland.

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ExaMAX2® Connector System: Elevating Performance and Compatibility in High-Speed Data Transmission

In the ever-evolving landscape of high-speed data transmission, technological advancements continue to push the boundaries of what is possible. The ExaMAX2® Connector System, a remarkable innovation in the field, stands as a testament to the relentless pursuit of excellence in signal integrity, compatibility, and overall performance.

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Advantages of Flex-to-Board Connectors in Modern Electronics

In the fast-paced world of modern electronics, the demand for compact and lightweight devices continues to soar. Flex-to-board connectors enable flexible and high-density interconnects between printed circuit boards (PCBs), LCDs, and various electronic components. As a result, they are increasingly adopted in automotive, smartphones, tablets, laptop PCs, wearables, robotics, and medical applications.

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CUSTOM INTERCONNECT SOLUTIONS, GLOBAL MANUFACTURING FOOTPRINT

Custom

Our engineering teams collaborate with our customers on 1000’s of projects every year, so no matter what technical, operational and even commercial challenges you face, Amphenol CS can develop a solution for you!

Plating

Our engineering teams have built a solid reputation with our customers, partnering with them every step of the way from concept and design to prototype and final production, in order to fulfill your custom requirements.

Expertise

Amphenol CS brings a broad array of innovative technology and solutions to support the growth of Information, Communications and Commercial electronics markets, particularly in plating, signal integrity performance, and power management.

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