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Amphenol provides high-density, high performance
interconnect solutions for server and storage equipment
used in multiple applications and markets
PCI Express® Gen 6 Card Edge Connectors
Amphenol PCIe® Gen 6 connectors exceed industry standard PCIe® 6.0 performance requirements. The optimized series supports backward compatible and is footprint interchangeable with PCIe® 5/4/3/2/1.
FlexFast™ FPC-to-Board connector's compact design address the growing demand for automotive application market. The connector design is compliant to USCAR-T3V2 and LV-214 S1 specifications.
Minitek MicroSpace™ High Voltage selective loaded Crimp-to-Wire Connector Platform
Minitek MicroSpace™ High Voltage selective loaded Crimp-to-Wire connector platform's unique design enables LV214 Severity-2 and performs at 3.81mm, 6.35mm, and 8.89mm pitch with 400V, 800V and 1200V.
SK Series - Sockets
Amphenol's patented compression mount contact technology utilizes industry-leading alloys to make cost effective and electrically robust socket solutions that offer high performance. With designs supporting pitches down to 0.4mm and speeds up to 40GHz, the SK series sockets are being used in cutting edge BGA, LGA and other small form factor IC applications.
Flexible Printed Circuit Assembly
BROAD OFFERING/HIGH PERFORMANCE/COST SAVING/CUSTOMIZED/VALUE ADDED FLEX CABLE ASSEMBLY Amphenol's BergStak®, MezzoStak®, Conan®, ComboStak® and PowerStak® are industry proven board-to-board solutions. To enlarge the advantages of these recognized board-to-board solutions, we have expanded our offering with Flexible Printed Circuit (FPC) assemblies,...
IDC connectors are small electronic components that help connect wires to circuit boards. They are commonly used in computers and other electronic devices to ensure fast and reliable connections between different components. These connectors work by piercing the insulation of a flat cable, making contact with the conductors inside.
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.
Paladin® 112Gb/s Backplane Cable
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next generation system architectures. Our customers are leading providers of datacenter switches and routers, enterprise servers and high performance computers.
e-MobilityAmphenol provides a broad array of compact, robust,
leading-edge interconnect solutions.
Amphenol Communication Solutions, Amphenol Advanced Sensors, and Amphenol RF will be participating in the LightFair 2023 event at The Javits Center in New York City on May 21st through May 25th.
Shanghai Amphenol Airwave Communication Electronics Co., Ltd, a subsidiary of Amphenol Corporation has partnered with NuCurrent, a global player in wireless power systems. This partnership will address the need to shift toward new standards such as Qi2 (pronounced “cheē tü”) standard.
The Open Compute Project (OCP) is a collective of industry experts joining forces to revamp hardware technology in order to meet the growing demands on computing infrastructure. Established in 2011, the Open Compute Project Foundation (OCP) leverages the benefits of open source and teamwork to accelerate innovation in data center technology, including networking equipment, servers, storage devices, and scalable rack designs.