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112G Ready, Set, Go
After nearly 5 years of development, the IEEE and OIF, have completed their 112G projects. Supported by numerous silicon and interconnect suppliers, 112G is now poised to take over the market. Chip-to-Chip implementations are looking for reliable, high-performance backplane, mezzanine, and copper cable interconnects to support short, medium, and long reach channels. Chip-to-Module implementations are looking for interoperable and backwards compatible solutions to support the robust optical transceiver market.

Industry standards provide a forum that fosters technology exploration and innovation. Consortiums and Multi-Source Agreements (MSAs) bring together manufacturers and implementors to help promote quality and consistency among the components inside data center, enterprise, and telecommunications networks. Standards also help drive the industry towards common architecture or link topologies. The pieces of each link may be unique for each architecture. A backplane, for example, is three sets PCB traces connected with two connector systems.

What constitutes a 112G solution?
If a component is shown to work within a given channel, it is a valid solution for 112Gb/s applications. Amphenol has 112Gb/s connector solutions for every type of application that requires a connector. Paladin® and ExaMAX® are used for mezzanine and traditional, cabled, and orthogonal backplane implementations. Amphenol SFP, SFP DD, QSFP, QSFP-DD, and OSFP connectors and cable are available for 112Gb/s applications. We also have solutions for more niche applications. For example, Mini Cool Edge, Swift, and Flash support 112Gb/s channels with intra-box point-to-point connectivity. While Amphenol’s OverPass products, like microLinkOVER™ and DensiLink® carry 112Gb/s data from the ASIC to directly to the backplane or front-panel pluggable port.

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112G High Speed Solutions


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