Get your sample by choosing part number(s) from the product page or using the search box above.
Manually add part number(s) here
112G High Speed Solutions
AMPHENOL'S GAME CHANGING 112Gb/s INTERCONNECT TECHNOLOGY.
Amphenol understands how to provide connector solutions to enable the higher speeds of today and tomorrow. We have the tools and expertise to help our customers electrically and mechanically – to support every type of interconnect needed for 112G integration.
Explore Solutions
112G Ready, Set, Go
After nearly 5 years of development, the IEEE and OIF, have completed their 112G projects. Supported by numerous silicon and interconnect suppliers, 112G is now poised to take over the market. Chip-to-Chip implementations are looking for reliable, high-performance backplane, mezzanine, and copper cable interconnects to support short, medium, and long reach channels. Chip-to-Module implementations are looking for interoperable and backwards compatible solutions to support the robust optical transceiver market.
Standards
Industry standards provide a forum that fosters technology exploration and innovation. Consortiums and Multi-Source Agreements (MSAs) bring together manufacturers and implementors to help promote quality and consistency among the components inside data center, enterprise, and telecommunications networks. Standards also help drive the industry towards common architecture or link topologies. The pieces of each link may be unique for each architecture. A backplane, for example, is three sets PCB traces connected with two connector systems.
What constitutes a 112G solution?
If a component is shown to work within a given channel, it is a valid solution for 112Gb/s applications. Amphenol has 112Gb/s connector solutions for every type of application that requires a connector. Paladin® and ExaMAX® are used for mezzanine and traditional, cabled, and orthogonal backplane implementations. Amphenol SFP, SFP DD, QSFP, QSFP-DD, and OSFP connectors and cable are available for 112Gb/s applications. We also have solutions for more niche applications. For example, Mini Cool Edge, Swift, and Flash support 112Gb/s channels with intra-box point-to-point connectivity. While Amphenol’s OverPass products, like microLinkOVER™ and DensiLink® carry 112Gb/s data from the ASIC to directly to the backplane or front-panel pluggable port.
After nearly 5 years of development, the IEEE and OIF, have completed their 112G projects. Supported by numerous silicon and interconnect suppliers, 112G is now poised to take over the market. Chip-to-Chip implementations are looking for reliable, high-performance backplane, mezzanine, and copper cable interconnects to support short, medium, and long reach channels. Chip-to-Module implementations are looking for interoperable and backwards compatible solutions to support the robust optical transceiver market.
Standards
Industry standards provide a forum that fosters technology exploration and innovation. Consortiums and Multi-Source Agreements (MSAs) bring together manufacturers and implementors to help promote quality and consistency among the components inside data center, enterprise, and telecommunications networks. Standards also help drive the industry towards common architecture or link topologies. The pieces of each link may be unique for each architecture. A backplane, for example, is three sets PCB traces connected with two connector systems.
What constitutes a 112G solution?
If a component is shown to work within a given channel, it is a valid solution for 112Gb/s applications. Amphenol has 112Gb/s connector solutions for every type of application that requires a connector. Paladin® and ExaMAX® are used for mezzanine and traditional, cabled, and orthogonal backplane implementations. Amphenol SFP, SFP DD, QSFP, QSFP-DD, and OSFP connectors and cable are available for 112Gb/s applications. We also have solutions for more niche applications. For example, Mini Cool Edge, Swift, and Flash support 112Gb/s channels with intra-box point-to-point connectivity. While Amphenol’s OverPass products, like microLinkOVER™ and DensiLink® carry 112Gb/s data from the ASIC to directly to the backplane or front-panel pluggable port.
High Speed IO
Featured Products
-
OverPass™ External High Speed IONear ASIC to External High Speed IO receptacles -
QSFP DD 400G Active Optical CableAmphenol's QSFP DD to QSFP DD 400G Active Optical Cable (AOC) assemblies doubles both the number of lanes from 4 to 8 and the bits sent per unit interval as compared to 100G QSFP28 AOC. -
OverPass™ InternalNear ASIC to cards or boards located within a system -
QSFP Cable AssembliesAAmphenol's QSFP copper cable assemblies are designed to meet data center, networking and... -
ExtremePort™ QSFP DD 112G ConnectorsAmphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. -
ExtremePort™ QSFP 112GAmphenol's ExtremePort™ QSFP 112G interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. -
QSFP DD Cable AssembliesAmphenol's QSFP DD (Double Density) passive copper cable assemblies double the number of... -
ExtremePort™ OSFP 112G ConnectorsAmphenol's ExtremePort™ OSFP 112G interconnect system is comprised of a 60 position, 0.60mm pitch connector designed for high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. -
OSFPAmphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high speed channels. The OSFP footprint is optimized for signal integrity. -
OSFP Cable AssembliesAmphenol's leading the industry in OSFP cable development. Our Electronics Products 'Product of... -
ExtremePort™ SFP112GAmphenol's ExtremePort™ SFP112G interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. -
ExtremePort™ Flash ConnectorAmphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extreme low profile design capable of transmitting high-speed signal up to 56G PAM4, and allows much greater signal path lengths, while maintaining SI performance when compared to conventional PCB routing methods. -
micro-LinkOVER™micro-LinkOVER™ is an above PCB twinaxial connector system that provides system designers and layout engineers a cost effective approach to unlock the design flexibility needed to manage the technical challenges of PAM4 56G and 112G systems and beyond. -
DensiLink®DensiLink® OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. These cables support 56G and 112G signaling in hardware system designs as well as technology for future 224G signaling systems. -
High Speed IO - CablesFull range of high speed cables
-
High Speed IO - ConnectorsFull range of high speed connectors
High Speed Backplane
Featured Products
-
OverPass™ - Cabled BackplaneNear ASIC to system backplane or coplanar cards -
Paladin®Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz. -
Paladin® HDThe Paladin® HD interconnect system provides world class bandwidth through industry leading density at 112GB/s performance. -
ExaMAX2®112Gb/s High-Speed Backplane ConnectorThe ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It... -
Cabled Backplane
Mezzanine
Featured Products
-
Paladin®Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects.
-
ExaMAX2®112Gb/s High-Speed Backplane ConnectorThe ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It...
Not finding what you’re looking for? Contact Us
112G High Speed Solutions
Resources
It’s Time For an Upgrade. What do we need to do?
Data usage is increasing every year, and the communications industry is working diligently to support
the increased demand. This article discusses why we need more data, what data center physical layer architecture changes
are needed to support higher data rates, and how Amphenol is well positioned to support your higher data rate systems.
Learn More
