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Paladin HD2®

Industry leading density and performance – your path 224Gb/s

  • Provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density
  • Supports up to 144 differential pairs orthogonally within 1U spacing
  • Consistent signal integrity performance over the entire mating range
  • Flexible architecture supports right angle female, direct orthogonal, and cables up to 12P
  • Individually assembled and discretely shielded with a revolutionary hybrid board attachment for maximized density and electrical performance
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OverPass™ Cabled Backplane

Near ASIC to system backplane or coplanar cards

  • Cable Backplane System portfolio products extend the reach of passive copper for next generation system designs
  • Performance beyond 224G PAM4
  • Optimization with our high speed, low loss twinax cable with PaladinHD2® and ExaMAX2® backplane connector families
  • Flexible connector architecture supports cable blind mating with a backplane cable, press fit headers, right angle and orthogonal configurations
  • Targeting support up through future PCIe 7.0 applications
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UltraPass™ Internal High Speed IO

Near an ASIC to a card or board’s location in the system

  • Delivering a simple, low-loss, direct link to pluggable modules or anywhere in the system
  • High speed, low profile and high density (bandwidth / mm2) near chip and on package solutions, the successor to our microLinkOVER™ and DensiLink™
  • Solutions available at 28G, 56G, 112G and 224G signaling speeds
  • Multiple cable exit options including straight, right angle, and coplanar
  • Construction options including
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ExtremePort™ QSFP-DD 224G Connector

One of the industry’s leading multi-lane pluggable form factors

  • Operating at 224Gb/s PAM4 signaling per channel, this connector features an optimized footprint ensuring superior signal integrity, with less than 2dB of loss at 53GHz
  • Delivering unprecedented performance in data transmission rates this device sets new standards for speed and reliability
  • This innovation promises to revolutionize data center networks and high-performance computing applications with its unparalleled performance and signal integrity
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UltraPort® QSFP 224G Connectors
  • Supports per port designs from 100G, 200G and 400G PAM4
  • Supports transmission speeds of up to 224G per lane
  • Passive & active cables available in all 4x form factors; 26AWG to 32AWG cable
  • Stacked, ganged and belly-to-belly connector and cage configurations
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ExtremePort™ OSFP 224G Connectors
  • Supports per port designs from 200G, 400G, 800G and 1.6T PAM4
  • 8 lanes per cable – 28G, 56G, 112G and 224G per lane capability
  • Thermal management engineered into cabled solution; available in all 4x form factors
  • PAM4 modulation providing solutions up to 1.6T aggregate bandwidth
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High Speed Bulk Cables

High frequency SkewClear EXD cable technology

  • Offerings include multi-pair cables: 2, 4 and 8 pair construction in wire gages from 32 AWG to 26 AWG (34 AWG in development)
  • Supports transmission speeds of 10G, 28G, 56G, 112G, and 224G.
  • Impedance tuned designs support: Paladin®, Paladin HD, ExaMAX®, ExaMAX+®, microLinkOVER™, Switi, Flash, GenZ, OverPass™ HSIO, DenslLink™, UltraPass
  • FEP insulated wiring for higher temperature environment
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TR90™ Multicoax Right Angle Connector
  • Low profile form factor with exceptional signal integrity out to 90 GHz
  • Available in 8 and 16 channel configurations
  • Uses same footprint as TR90 Straight Mount
  • Ideal for 112G/224G IC design characterization and validation
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Substrate Launch Test Fixture (SLTF)
  • Ideal for 112G/224G IC design characterization and validation
  • TR Multicoax design is integrated with the Ardent SK high speed socket & lid for an all-in-one solution
  • Compression interface requires no solder-down components on fragile substrates/silicon

Explore Solutions

224G Enabling Technologies
As the industry gears up to define 224G, existing architectures will be pushed to their limits and innovative technologies will be given the opportunity to supplant older architectures as the new standard. Intra-box point-to-point cable assemblies will move closer-to, or even on-to chip packages as system implementors are pushed to limit the number of connection points in each link. Thermal challenges will be as critical as electrical performance. Amphenol’s portfolio of modules, cages, and heatsinks provide a holistic solution for customers looking to solve system concerns.

For 224Gb/s applications, copper interconnect is not “dead”, but will need to adapt to compete with next-generation optics solutions. Active Copper Cables (ACCs) and Active Electrical Cables (AECs) will likely displace some passive copper Direct Attach Cables (DACs). Pluggable optical transceivers will be challenged by on-board or mid-board solutions looking to lower, or more evenly distribute, thermal load density throughout the system. There are several active Consortiums and Multi-Source Agreements (MSAs) looking to build consensus support to enable interoperability around these new technologies. These efforts will help major industry standards like IEEE, OIF, and OCP establish their 224G projects.

What constitutes a 224G solution?
At this early stage there could be many paths to a 224G solution. Amphenol has several solutions that are well-positioned to support the development effort. These solutions support a wide range of architectures solving reach, density, and thermal challenges. Amphenol’s OverPass products help provide advanced electrical performance without compromising practical physical reach. Convergence between our mezzanine and backplane configurations will support the transition to new architectures and promote the possibilities of co-packaging solutions.

To find out how we can help you develop your 224G solution Contact Us