Data Centers

Amphenol offers high-performing, low-resistance Busbar connectors with designs to conveniently distribute power between busbars, cables, and circuit boards.

Learn about the latest trends and interconnect solutions in open hardware collaboration. Amphenol Communication Solutions is excited to present several new key products for the Open Compute Project (OCP) community

Amphenol's BarKlip^® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars

Amphenol's 1.0mm pitch DirectAttached™ CEM (DA CEM) is a hybrid card edge solution with high-speed signal pins designed to directly attach to the cable to eliminate PCB trace loss and press-fit termination type power pins for better rework

Amphenol offers high-performing, low-resistance Busbar connectors with designs to conveniently distribute power between busbars, cables, and circuit boards

This video shows how Amphenol solved a design challenge in Graphic Processing Unit application and provided a solution to meet the following requirements: • High Current interconnect solution for internal power distribution in Graphics card. • Robust secure mating retention • Supports Pin-in-Paste (PiP) and shorter termination pins with no pegs Minitek® Pwr 3.0 High Current Connector was chosen for these reasons: • Up to 12A rated current per contact • Positive locking on housing with low thumb latch operation ensures secure mating retention • Flexing beam design enables low insertion force during mating • Pin-in-Paste connectors with shorter termination pins and no pegs, with -40°C to +105°C operating temperature

This video shows how Amphenol solved a design challenge in a next-generation enterprise storage and server platform and provided a solution to meet the following requirements: • Able to withstand high levels of system-level shock and vibration • Space-saving design • Able to accept DDR5 memory modules that conform to JEDEC MO-329 DDR5 Memory Module Sockets (SMT) with Narrow Latch was chosen for these reasons: • Narrow latch design to facilitate system airflow. Metal tab integrated into the latch for increased robustness • Single latch solution reduces the space required to release DIMM module, freeing up valuable board space • Superior Signal Integrity and high-temperature warpage performance • Designed to accept DDR5 memory modules that conform to JEDEC MO-329