background-body

Explore Solutions

PCIe Gen 4/Gen 5 BergStik 2.54mm PwrBlade Micro Power Plus Quickie IDC Minitek Pwr 3.0 DDR Minitek 2.00mm Wire to Board ExtremePort OSFP UltraPort QSFP Modular Jack Magnetic Jack 2xN

We provide reliable integrated signal integrity solutions across High Speed IO, Backplane, and Mezzanine Connectors and Cables to meet the expansive goals of AI/ML. Adhering to PCIe and DDR standards, high performance storage and memory connectors along with high speed magnetic modular jacks and wire to board power connectors for all your AI/ML applications.

High Speed Solutions

    Chipsets

  • PLCC, Memory & Media Sockets
  • Compression Mount High Density Interposers
  • Test & Measurement Solutions
  • Reference Designs

    Networking

  • Co-package & Near Package Solutions
  • 56G / 112G / 224G
  • High Speed Compliance Testing & Validation Resources
  • Reference Designs

    Server + GPU

  • PCIe Gen 5 & 6
  • Network & Expansion Cards
  • Storage & Memory
  • High Speed Board to Board & Cabling Options
  • Power Distribution Solutions
  • Reference Designs

High Speed IO

High Speed Backplane

Mezzanine

High Speed Card Edge

Memory Module

Storage

Input Output

Power

Busbar

Fan

Board to Board

Not finding what you’re looking for? Contact Us

Artificial Intelligence

Resources

Profiling Connectivity in Machine Learning Applications

The past decade has witnessed massive advancements in hyper-scale data centers and a rise in connected devices leading to annual global data growth exceeding several trillion gigabytes. High-performing computers have been set up in centrally located data centers to use these zettabytes to aid humanity in achieving new heights by exploring Artificial Intelligence (AI). Though Neural networks, which form the foundation for Machine Learning (ML) or Deep Learning in Artificial Intelligence (AI), were projected decades ago, the computing power to put them into practice was created recently. Learn more about how Amphenol is enabling this technology revolution and providing you with solutions.
Learn More

Engineering Support

Our solutions are engineered to empower the technologies of tomorrow with 2000+ Engineers globally and world class design, manufacturing and testing capability.

We have a long history of operating in quality demanding end markets. Our robust and fully transparent quality systems are efficiently managed by a large Quality Team.
Contact us for your AI interconnect system needs

Standards Committee Partnerships

We are part of various MSA committees to design and build next generation systems and we partner with key Standards Committees: