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Artificial Intelligence Machine Learning
Amphenol enables connectivity solutions with density, high performance and
engineering expertise
Explore Solutions
We provide reliable integrated signal integrity solutions across High Speed IO, Backplane, and Mezzanine Connectors and Cables to meet the expansive goals of AI/ML. Adhering to PCIe and DDR standards, high performance storage and memory connectors along with high speed magnetic modular jacks and wire to board power connectors for all your AI/ML applications.
- PLCC, Memory & Media Sockets
- Compression Mount High Density Interposers
- Test & Measurement Solutions
- Reference Designs
Chipsets
- Co-package & Near Package Solutions
- 56G / 112G / 224G
- High Speed Compliance Testing & Validation Resources
- Reference Designs
Networking
- PCIe Gen 5 & 6
- Network & Expansion Cards
- Storage & Memory
- High Speed Board to Board & Cabling Options
- Power Distribution Solutions
- Reference Designs
Server + GPU
High Speed IO
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ExtremePort™ OSFP 224G ConnectorsAmphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm... -
PCIe® Gen 6 Mini Cool Edge IO ConnectorAmphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm... -
OverPass™ InternalNear ASIC to cards or boards located within a system -
ExtremePort™ QSFP-DD 224G ConnectorsAmphenol's ExtremePort™ QSFP-DD 224G interconnect system is comprised of a 76 position,... -
QSFP DD OverPass™ AssembliesQSFP DD OverPass™ products remove high speed signaling from the PCB and create an eight... -
OverPass™ External High Speed IONear ASIC to External High Speed IO receptacles -
QSFP28/56/112G Cable AssembliesAmphenol's QSFP28/56/112G cable assembly is designed to meet data center, networking and high performance computing application. -
ExtremePort™ OSFP 112G ConnectorsAmphenol's ExtremePort™ OSFP 112G interconnect system is comprised of a 60 position, 0.60mm pitch connector designed for high-speed serial applications. -
OSFP Interconnect SystemAmphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high speed channels. The OSFP footprint is optimized for signal integrity. -
OSFP Cable AssembliesAmphenol's leading the industry in OSFP cable development. Our Electronics Products 'Product of the Year' award-winning OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with 25G/lane channel NRZ up to 112G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G, 400G, and 800G per cable assembly. -
ExtremePort™ SFP112GAmphenol's ExtremePort™ SFP112G interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. -
QSFP+ Copper Cable Assemblies 40GAmphenol's QSFP (Quad Small Form Factor Pluggable) cable assemblies are designed to meet emerging data center and high performance computing application needs for high density cabling interconnect systems capable of delivering aggregate data bandwidths of 40Gb/s.
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ExtremePort™ QSFP+Amphenol's ExtremePort™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cost optimized solutions. -
Mini-SAS HD Active Optical CableAmphenol's Mini-SAS HD Active Optical Cable is fully compliant to SAS 2.1 and SAS 3.0 industry standards as well as the SFF-8636 interface standard. -
micro-LinkOVER™ OverPass™ Assembliesmicro-LinkOVER™ OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect by overpassing the PCB. -
DensiLink® OverPass™ AssembliesDensiLink® OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. -
High Speed IO - CablesFull range of high speed cables -
High Speed IO - ConnectorsFull range of high speed connectors
High Speed Backplane
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OverPass™ - Cabled BackplaneNear ASIC to system backplane or coplanar cards -
Paladin® 112Gb/s Backplane ConnectorPaladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz. -
Paladin® HD 224Gb/s Backplane Interconnect SystemThe Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s... -
ExaMAX2®The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. -
ExaMAX+®High Speed Backplane ConnectorThe ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. -
ExaMAX® 56Gb/s High-Speed Backplane 92Ohm ConnectorExaMAX® backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion. -
XCede® HD Backplane ConnectorXCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. -
XCede® Plus Backplane ConnectorXCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. -
XCede® HD2 Backplane ConnectorWhile maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. -
Cabled Backplane
Mezzanine
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cLGA® Land Grid Array Socket SystemThe Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness. -
cStack™ High Speed Solderless InterconnectsThe Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. -
Lynx™ Low Profile ConnectorAmphenol's Lynx™ is a 4-row product offering doubling the density in a 2-row footprint that is suitable for a wide variety of applications in datacom, enterprise server, telecommunication, industrial, medical and test systems. -
Lynx™ QD Quad Differential SolutionOptimized for differential pair signaling, Lynx™ QD sets a new standard for density and flexibility that offers an innovative, high performance interconnect with PCIe® Gen 5 support. Lynx™ QD supports data rates of 56 Gb/s PAM4 and provides a 4 row differential signaling structure, in a compact 2 row footprint. -
InfinX® High-speed Mezzanine ConnectorThe InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX is your best choice for high speed board-to-board applications. -
M-Series™ VR Mezzanine ConnectorLeveraging proven technologies, including an industry-leading BGA design, this connector system...
High Speed Card Edge
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EDSFF E1/E3 High-Speed Cable AssemblyAmphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via... -
PCI Express® Gen 5 DirectAttached™ Cable RiserPCIe® DirectAttached™ cable riser solution supports upto PCIe® 5.0 data rate of 32Gb/s, which... -
PCI Express® Gen 6 Card Edge ConnectorsAmphenol PCIe® Gen 6 connectors exceed industry standard PCIe® 6.0 performance... -
PCIe® Gen 6 Mini Cool Edge 0.60mm Card Edge ConnectorsMini Cool Edge is a 0.60mm high-density, high-speed card edge connector for new-generation... -
Hyper Cool Edge ConnectorsAmphenol's Hyper Cool Edge system supports the Pluggable Multi-purpose Module (SFF-TA-1034)... -
PCI Express® Gen 4 and Gen 5 Card Edge ConnectorsPCIe® Gen 4 and Gen 5 connectors outperform industry standard PCIe® 4.0 and 5.0 (Proposed) requiring higher speed performance. The optimized series supports backwards mating and is footprint compatible with PCIe 3/2/1. -
Mini Cool Edge 0.60mm ConnectorsMini Cool Edge is a 0.60mm high density, high speed card edge connector for new generation small form factor system. This fine pitch solution offers multiple BTB applications like right angle, mezzanine and coplanar and support cable interconnect options. -
Double Density Cool Edge 0.80mm Connectors and Cable AssembliesThe 0.80mm pitch Double Density Cool Edge connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single piece connector can accommodate both high speed and low speed signal and power. -
Cool Edge 1.00mm PCIe ConnectorsCool Edge PCIe® connectors bring high speed PCIe® support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher density applications. -
PCIe® M.2 Gen 5 Card Edge ConnectorsAmphenol's PCIe® M.2 Gen 5 Connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options and supports higher data rates compared to PCIe® Mini Card connector. -
Cool Edge 0.80mm Hybrid Power & Signal ConnectorsCool Edge Hybrid Power and Signal connectors provide one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar and midplane/backplane. -
PCIe® M.2 Gen 3 and Gen 4 Card Edge ConnectorsAmphenol's PCIe® M.2 Gen 3 and Gen 4 connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® 3.0, USB 3.0 and SATA 3.0 applications, making it suitable for tablets, laptops and low profile storage and server applications. -
Slim Cool Edge 0.65mm Hybrid Power & Signal ConnectorsSlim Cool Edge Hybrid Power and Signal connectors provide one-piece high speed and high power card-edge package. These connectors offer cost competitive and high density solutions. -
PCI Express - 10147430-113T0LFPCI Express® x16 vertical Card Edge Connector, SMT, 164 Positions, 1mm (0.039inch) Pitch, with locked Latch -
PCI Express - 10150775-113Y0LFPCI Express® x16 vertical Card Edge Connector, 164 Positions, 1mm (0.039inch) Pitch, with side latch -
PCI Express - 10163106-361311HLFPCI Express® GEN 5 Card Edge, Storage and Server Connector, Vertical, straddle mount, x1, 36 Positions, 1.00mm (0.039in) Pitch -
PCIE M.2 - 10166503-004RHLFPCIe M.2 Connectors, Storage and Server Connector, P=0.5mm, Stacked, Key M, 15μin Gold Plating -
Double Density Cool Edge 0.80mm - CED014281112001Double Density Cool Edge, storage and server connectors, SMT, 428 signal pins, 0.8 mm, Vertical, 2.36mm AIC -
Cool Edge - CEC000761122100Double Density Cool Edge Cable 0.8mm,76 signal pins,32AWG high speed cable,Parallel VS Parallel,Cable length of 100mm -
Mini Cool Edge 0.60mm - ME3005630702111Mini Cool Edge 0.6mm Orthogonal, Gen 5, 2pcsEDSFF, 1*1, 56pins, 7.805mm offset, With screw, Die Casting Shell -
Mini Cool Edge 0.60mm - ME1005613401201Mini Cool Edge 0.60mm Connectors, Storage & Server System, 56 signal pins, Surface Mount Termination, Straddle mount, 2.36mm PCB, 0.0mm offset, 0.60mm (0.023in) Pitch.
Memory Module
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DDR5 Memory Module Sockets (SMT)Vertical DDR5 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR5 memory modules that conform to JEDEC MO-329. -
DDR4 Memory Module SocketsVertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. -
DDR4 SO-DIMM Memory Module SocketsDDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. -
DDR4 Ultra Low Profile Memory Module SocketsDDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. -
DDR5 SMT - DDR506112002KQDIMM Socket, Narrow latch, Surface mount termination with board lock -
DDR5 SMT - DDR504111002KQDDR5 Memory Module Sockets, Storage and Server System, Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 15μin Gold on Contact Area, Standard Housing and Latch, Metal Tab, Without MYLAR
Storage
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SAS/PCIe 5.0 (U.2 & U.3) ConnectorsSAS/PCIe 5.0 (U.2 & U.3) connectors comes with 32GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers. The 68-position, SAS/PCIe receptacle and header enables implementation of high speed Serial Attached SCSI (SAS) hard disk drive (HDD) interface as well as Peripheral Component Express (PCIe)-based devices. -
SAS/PCIe 4.0 (U.2&U.3) ConnectorsSAS/PCIe® 4.0 (U.2&U.3) connectors come with 16GT/s (PCIe® lanes) or 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers. The 68-position, SAS/PCIe® receptacle and header enables implementation of high speed Serial Attached SCSI (SAS) hard disk drive (HDD) interface as well as Peripheral Component Express (PCIe®)-based devices. -
SATA (Serial ATA) ConnectorsAmphenol offers a wide range of high performance SATA connectors. They are designed to support up to 12Gb/s, enabling the implementation of low cost, high speed, high capacity hard disk drive (HDD). -
SAS 4.0 ConnectorsSAS 4.0 connectors for next-generation servers with 24Gb/s speeds. The 29-position receptacle and plug connectors feature hot-plugging and blind-mating, connector misalignment compensation, and a PCB retention mechanism for robust SMT attachment. -
SAS PCIe - PSAS5F3130031TRSAS PCIe,Storage connectors, PSAS 5.0, 68pin, Vertical, Receptacle, blade hold down -
SAS PCIe - PSAS5F2130021TRSAS PCIe,Storage connectors, 5.0, receptacle, Right Angle, Surface Mount -
MEZZOSTAK® 0.50mm Pitch 5.2mm Stacked HeightMezzostak® 0.50mm is a robust fine-pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The innovative hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance.
Input Output
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USB 4 Gen 3 Type CUSB 4 connectors compatible with Thunderbolt 4 interface combines power charging, tunneling USB, PCIe® data transfer, and DP video and audio capability in a single Type C connector. -
USB Type CUSB Type C connectors are expected to be widely used as a next-generation interface. They support a variety of protocols such as USB2.0/3.0/3.1 and meet Superspeed communication 10Gb/s, 5A and 20V power supply. -
Modular Jack - Right Angle - High SpeedOur Right Angle High-Speed line of modular jacks (1 to 10Gb/s) meet Cat5e, Cat6, and Cat6A specification performance levels per EIA-568-C.2. All modular jacks support PoE Types 1 to 4 and are RoHS and IEC 60603-7 compliant. -
Magnetic Jack (RJMG) - StackedRJ45-USB combo solution supporting 100BASE-T ,1, 2.5, 5 and 10Gb/s Ethernet PHY RJMG series offer a wide variety of fully RoHS compliant Magnetic Modular Jacks for RJ45. The right angle through hole type is offered in RJMG Stacked USB 2.0/3.0. -
D-Sub Standard Board Mount ConnectorsAmphenol's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Military, Instrumentation and Medical. -
HDMIAmphenol HDMI supports standard or high-definition video, plus multi-channel digital audio on a connector. It transmits all ATSC HDTV standards and supports 8-channel digital audio. -
Magnetic Jack (RJMG) - 1xNMulti port RJ45 solution supporting 100BASE-T, 1, 2.5, 5 and 10Gb/s Ethernet PHY. RJMG series offer a wide variety of fully RoHS compliant Magnetic Modular Jacks for RJ45. The right angle throughhole type is offered in 1xN (1x2, 1x4 through 1x8) port with tab-up and tab-down options. -
Magnetic Jack (RJMG) - 2xNStacked and ganged RJ45 solution supporting 100BASE-T, 1, 2.5, 5 and 10Gb/s Ethernet PHY. RJMG series offers a wide variety of fully RoHS compliant Magnetic Modular Jacks for RJ45. The right angle and through hole type is offered in 2xN (2x1, 2x2, 2x4, 2x6, and 2x8) port with tab-up and tab-down options. -
Magnetic Jack (RJMG) - 1x1Single port RJ45 solution supporting 100BASE-T , 1, 2.5, 5 and 10Gb/s Ethernet PHY. RJMG series offer a wide variety of fully RoHS compliant Magnetic Modular Jacks for RJ45. Both right angle and vertical through hole types are offered in single port with tab-up and tab-down options. -
Modular Jack - Right Angle - Standard SpeedOur Right Angle Standard Speed line of modular jacks (< 1Gb/s) are Cat3 and Cat5 compliant. All modular jacks support PoE Types 1 to 4 and are RoHS and IEC 60603-7 compliant. -
USB 2.0 ConnectorFCI Basics USB 2.0 connector delivers a data rate of up to 480Mb/s. The Universal Serial Bus interface is ideal for use in connecting removable storage devices into automotive multimedia systems, but extends its functionality to across a variety of domains in consumer, datacom, and industrial applications.
Power
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Minitek® Pwr CEM-5 PCIe® Connector SystemAmphenol introduces the Gen 5, Minitek® Pwr PCIe® connector system. This new introduction CEM 5.0 PCI Express® 12VHPWR auxiliary hybrid connector and cable assembly support the 600W GPU cards. The 12VHPWR connector is not designed to mate with legacy PCI Express® 2x3 and 2x4 12V Auxiliary Power connectors. -
Minitek® Pwr 3.0 Connector SystemMinitek® Pwr 3.0 is a flexible and comprehensive solution designed for power application with current rating up to 8.5A per circuit. It is available in 2 to 24 circuits for dual row and 2 to 12 circuits for single row. -
Minitek® Pwr 4.2 Connector SystemMinitek® Pwr 4.2mm is a flexible and comprehensive solution designed for power application with current rating up to 9A per circuit. It is available in 2 to 24 circuits for dual row and 3 to 5 circuits for single row. -
PwrBlade® MiniMezz Connector SeriesThe PwrBlade® Mini connector series introduces enhanced features to our existing PwrBlade® products in a smaller profile. PwrBlade® MiniMezz is available in stack heights ranging from 8mm - 20mm with options for power & signal contacts. -
PwrBlade® ConnectorThe PwrBlade® power distribution connector system from Amphenol includes power and signal contacts to provide power distribution and power control in a single connector. Options for either vertical or right-angle versions of PCB-mount headers and receptacles deliver support for coplanar, backplane or mezzanine connections. -
PwrMAX® G2 Power ConnectorPwrMAX® G2 is the highest density blind mate power and signal connector available. PwrMAX® G2 series carries up to 100A per contact, and features design improvements to reduce board space depth, while also improving the blind mate gatherability. -
3000W EnergyEdge™ X-tremeThe NEW 3000W EnergyEdge™ X-treme Card Edge series offers the highest linear density available in the market today. The EnergyEdge™ product series features twice as many contact points allowing for a 25% improvement in linear current density when compared to existing card edge products. -
CoolPower® SDM ConnectorsCoolPower® Slim Drawer Mini (SDM) Connectors offer a high level of mating configuration flexibility, current density, and a thin profile making it ideal for compact board-to-board power interconnects. -
PwrLoPro®PwrLoPro® connectors are a family of board-to board power connectors designed to deliver more current with lower profile height and less board space. PwrLoPro® stands 8mm off the edge of the printed circuit board which leaves more space for air flow. The stamped-and-formed power contact can reach the current density of 160A/inch within such compact design. -
PwrMAX® Power ConnectorThe PwrMAX® connector family offers a compact means for connecting up to 100A DC power in modern system architectures requiring high density and high current. Configurations include coplanar, backplane, mezzanine and orthogonal.
Busbar
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BarKlip® BK600 I/OAmphenol's BarKlip® BK600 I/O power cable assemblies feature an OCP-compatible design... -
OCP 48V BarKlip® BK500 IOAmphenol's OCP 48V compliant Barklip® BK500 power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards. -
OCP 48V BarKlip® BK150 IOAmphenol's OCP 48V compliant Barklip® BK150 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards and provide a convenient method of distributing up to 150A per contact between busbars, cables, and circuit boards. -
BarKlip® BK300 ConnectorThe BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. These power beams provide lower overall resistance by maintaining contact with the mating busbar through common misaligned conditions. -
BarKlip® BK200 I/OAmphenol's BarKlip® BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. -
BarKlip® XP ConnectorsAmphenol's BarKlip® XP connectors feature independent points of contacts that provide overall lower resistance and greater overall efficiency. BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications. -
BarKlip® BK100 I/OAmphenol's BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards.
Fan
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WTB BMI Fan ConnectorsAmphenol's wire-to-board fan connectors come with Blind-Mate Interface. The 1.25mm pitch wire-to-board connectors meet a maximum of 2.8A/pin current carrying capacity, whereas the 2.00mm pitch wire-to-board connectors meet a maximum of 5.3A/pin and the 2.54mm pitch wire-to-board connectors meet a current-carrying capacity of maximum 5.5A/pin. -
Fan Connector Card-to-WireCTW (Card-to-Wire) fan module connector comes with a flexible design for card-to-wire power applications used in fan modules. It allows different wire gauges ranging from 28AWG - 22AWG. The connector provides a maximum current rating of 4A/pin.
Board to Board
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BergStak HS™ 0.80mm Board-to-Board ConnectorFCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. -
BergStak® 0.80mm Shielded Board-to-Board ConnectorFCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s. -
BergStak® 0.80mm PitchFCI Basics BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions. -
BergStak+™ 0.80mm Mezzanine ConnectorBergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is completely compatible with the existing BergStak® 0.80mm product recommended by the Open Compute Project (OCP). -
Conan® 1.00mm ConnectorAmphenol's Conan® 1.00mm is a mezzanine connector designed for industrial applications and...
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Artificial Intelligence
Resources
Profiling Connectivity in Machine Learning Applications
The past decade has witnessed massive advancements in hyper-scale data centers and a rise in connected devices leading to annual global data growth exceeding several trillion gigabytes. High-performing computers have been set up in centrally located data centers to use these zettabytes to aid humanity in achieving new heights by exploring Artificial Intelligence (AI). Though Neural networks, which form the foundation for Machine Learning (ML) or Deep Learning in Artificial Intelligence (AI), were projected decades ago, the computing power to put them into practice was created recently. Learn more about how Amphenol is enabling this technology revolution and providing you with solutions.
Learn More
Engineering Support
Our solutions are engineered to empower the technologies of tomorrow with 2000+ Engineers globally and world class design, manufacturing and testing capability.
We have a long history of operating in quality demanding end markets. Our robust and fully transparent quality systems are efficiently managed by a large Quality Team.
Contact us for your AI interconnect system needs
We have a long history of operating in quality demanding end markets. Our robust and fully transparent quality systems are efficiently managed by a large Quality Team.
Standards Committee Partnerships
We are part of various MSA committees to design and build next generation systems and we partner with key Standards Committees:
