Amphenol is making its presence felt in the world of Artificial Intelligence and Machine Learning as it gets ready for the AI Hardware & Edge AI Summit 2024. It’s set to be a landmark event in the AI and machine learning (ML) calendar. Scheduled from Tuesday, September 10 to Thursday, September 12, at the Signia by Hilton in San Jose, California, you can find Amphenol at Booth 73, showcasing our latest advancements in connectivity solutions tailored for AI and ML applications.

 

Here is all you need to know about Amphenol’s presence at the AI Hardware & Edge AI Summit 2024!

AI Hardware & Edge AI Summit 2024 Overview

The AI Hardware & Edge AI Summit is renowned for bringing together the brightest minds and leading companies in the AI and ML ecosystem. This year’s event promises to be no different, with a comprehensive agenda that includes hands-on developer workshops, masterclasses, product launches, and networking opportunities. The summit aims to foster collaboration in developing, deploying, and scaling machine learning systems that are swift, cost-effective, and efficient.

Amphenol @ Experts Panel

One of the biggest highlights of the AI Hardware & Edge AI Summit is the knowledge sharing by the thought leaders and industry experts on the latest advancements in AI and ML.

Albert Chen from Amphenol will be participating in panel discussions at the summit. He will provide valuable insights into the intersection of hardware such as interconnect solutions and AI/ML, discussing the challenges, trends, and innovations shaping the industry. Attendees can expect to gain valuable insights into cutting-edge technologies, best practices, and future trends from these sessions.

What’s On Focus at Booth 73?

Amphenol, a global leader in interconnect systems, will be at the forefront of the AI Hardware Summit this year, showcasing its high-performance AI product offerings. Attendees can discuss a range of connectivity solutions designed to meet the demanding requirements of AI and ML systems with the Amphenol team. Make sure to visit us at Booth 73 where we will be showcasing our innovative and high-speed interconnect solutions.

Key Highlights at Booth 73

Amphenol is set to showcase its cutting-edge high-speed cabled backplane solutions at the AI Hardware and Edge AI Summit 2024. With over 30 years of experience leading the backplane interconnect market, Amphenol’s technology is renowned for its reliability and performance. Our backplane connectors, including the XCede®, and ExaMAX® series, are designed to meet the rigorous demands of AI and ML applications. These connectors are blind mate compatible with other board-mounted backplane connectors and come in multiple pair count configurations, making them highly adaptable to various system requirements. The configurable nature of these connectors allows for custom pin counts, guidance, and form factor requirements, ensuring seamless integration into diverse AI and ML infrastructures.

Among the products on display, the Paladin® Backplane Cable and the ExaMAX® Backplane Cables stand out for their exceptional data transfer capabilities. The EXAMAX2® High-Speed Backplane Connector, another product known for its high-speed capabilities, is designed to support the next generation of AI applications, providing unparalleled speed and efficiency.

Other connectors that will be showcased are the 600-Amps-capable BarKlip® BK600 I/O, known for its mating configuration flexibility, current density, and thin profile, making it ideal for compact board-to-board power interconnects. This connector is also OCP-compatible, aligning with the Open Compute power distribution architecture. Furthermore, the BarKlip® BK 220 Nano, a new variant to the BarKlip® series will also be on showcase.  

Amphenol will also present the OCP ORv3 AC Input Connector and Cable Assemblies, designed to meet OCP’s V3 Universal Input power distribution architecture standards, providing a convenient method of routing power directly from the busway to the power shelf within the V3 rack. The PwrBlade® ULTRA HD+ BTB Connector System, featuring an enhanced high-power contact design capable of providing up to 100A per contact (per 4 adjacent contacts) and high-density signal options with up to 6 signal pins per column, will also be on display. This series includes Amphenol’s proprietary silver-based plating technology GCS®, ensuring best-in-class current carrying capability and ultra-low end-of-life contact resistance of 0.4mΩ max.

Another prominent connector series on display will be the CoolPower® SDM Connectors, offering high current CoolBand power contacts for maximum performance, underscoring Amphenol’s commitment to providing advanced, reliable solutions for AI and other high-performance applications.

Amphenol will also display the AMD SP5 BGA/LGA Socket Assembly connector, a BGA (Ball Grid Array) crucial for high-performance computing applications. ensuring reliable and efficient connections for AMD processors.

Amphenol Backplane Systems and Integrations (ABSI) will be showcasing its prowess with a backplane system designed to support storage and switch-routing systems up to PCIe 6.0 or 112Gb/s. This system offers a cost-effective PCB-based midplane solution, highlighting Amphenol’s commitment to providing advanced and economical solutions for high-speed data applications.

Meet us at AI Hardware Summit @ Booth 73

The AI Hardware Summit 2024 is poised to be an exciting event for anyone involved in AI and ML. Amphenol’s presence at Booth 73 will undoubtedly be a highlight, offering attendees a glimpse into the future of AI connectivity. Don’t miss the opportunity to explore Amphenol’s cutting-edge solutions and gain insights from industry experts.

For additional information, talk to our 24/5 LiveChat Technical Team!