As the tech world converges in the heart of innovation at the Santa Clara Convention Center on January 31st and February 1st, 2024 for DesignCon, Amphenol will make a mark with pioneering solutions in interconnect technologies at Booth #833.

Date: January 31st and February 1st
Time: 11 AM - 6 PM
Venue: Santa Clara Convention Center, Great America Parkway, Santa Clara, CA
Booth: #833

Highlighted Demonstrations

The Amphenol team is planning a diverse display of live technical demonstrations promoting new products and highlighting collaborative efforts with valued industry partners. The demonstrations are grouped into three categories Next-Gen Data Center, Server Innovation, and 224G Ecosystem.

Next-Gen Data Center

EXAMAX2®ARK, 112G Backplane Connector in Immersion Fluid

Amphenol’s High-Speed Backplane Connector team will be showcasing a new product in the ExaMAX® family. ExaMAX2® ARK is derivative of the broadly adopted ExaMAX® product series designed to operate in immersion-cooled systems. The live demonstration will show real 112GbE traffic running through the ExaMAX2® ARK interface operating in a fully submerged environment.

800Gbe OSFP Linear Pluggable Optics (LPO)

Amphenol's XGIGA team will be publicly debuting a Linear Optics solution at DesignCon this year with their OSFP800-DR8 module. Linear Pluggable Optics (LPO) has created a buzz across the industry as data centers look to take advantage of the incredible performance capabilities from 112 Gb/s silicon. The live demonstration will display module and link performance in a practical implementation and highlight advantages of Linear Optics solutions over alternatives solutions.

Server Innovation

HSIO Active Electrical product displays

Amphenol’s High-Speed IO Cable team will be debuting a new cable assembly aimed at the PCIe Market. Using the OSFP-XD form factor, the PCIe® 5.0 Active Electrical Cable (AEC) aims to provide the longest physical reach for a copper solution. The use of retimers in PCIe links enables platform architects the flexibility to better enable support for the industry trend to disaggregate server resources within a data center rack.

PCIe® 6.0 with MCIO and EDSFF E3.2C

Server platforms are comprised of multiple interconnect solutions that must combine to connect together various compute and storage elements. Amphenol’s Server and Storage IO, Commercial IO, and AssembleTech teams are promoting their solutions together in a live demonstration of a PCIe® 6.0 link. The demonstration will feature Amphenol’s Mini Cool Edge IO (MCIO) connector and cable assembly, SureLink cable extension interface, and a cabled E3.2C solution for connectivity to the storage endpoint.

224G Ecosystem

Paladin®HD2 and UltraPass™ Active Demo Channel

The push towards faster data rates is forcing many system architects to turn to cabled solutions. Amphenol’s High-Speed Backplane Connector, Cable Backplane Systems, and High-Speed IO Connector teams are showcasing their 224 Gb/s solutions together in a unique interconnect topology. The cabled-fabric could be across multiple applications within a data center rack. The live demonstration will feature Amphenol Paladin® HD2 right-angle female (RAF) board mount connector, a Paladin® HD2 pass-thru cable assembly, and UltraPass. UltraPass™  is Amphenol’s newest OverPass® solution for providing high-density, 224 Gb/s performance for near-ASIC interfaces.

224G Ecosystem showcasing QSFP-DD1600

Amphenol’s High-Speed IO Connector team will be debuting a new QSFP-DD solution at DesignCon this year with their QSFP-DD1600 SMT. QSFP-DD remains a very popular form factor for data center, enterprise, and telecommunications applications. The live demonstration will show the progress of 224 Gb/s silicon development working with the QSFP-DD1600 connector and cage solutions.

About DesignCon 2024

DesignCon 2024 stands as the nexus of innovation for chip, board, and systems design engineers, offering a dynamic platform in the heart of Silicon Valley. This year's conference introduces the "40 Under 40" program, nurturing emerging talent with a comprehensive educational experience. The conference and expo provide a deep dive into the latest technological advancements, featuring a 14-track conference, an expansive expo hall, and the Drive World expansion focusing on electric vehicle technology. With the prestigious Engineer of the Year award and a stellar lineup of sponsors, DesignCon 2024 is set to elevate expertise, connect industry leaders, and shape the future of electronic design.

As Amphenol proudly exhibits at DesignCon 2024, attendees can expect to be captivated by a vision of the future—one where seamless, high-speed connectivity is not just a possibility but a reality. Amphenol's innovative demonstrations at Booth #833 affirm its status as a leader in interconnect technology, driving the industry forward into a new era of connectivity excellence.