Amphenol is excited to invite you to the 30th DesignCon, a premier event in the tech industry that will take place from January 28th to 30th, 2025, at the Santa Clara Convention Center in California.

DesignCon 2025 is a premier event focused on high-speed communications and system design. It is a must-attend event for chip, board, and systems design engineers to network, source, and stay ahead of industry change.

Meet Amphenol at Booth 833

Demos

At Booth 833, attendees can interact with our experts and explore these demos:

  • cLGA® - The Future of Socketed Memory

Demo showcases Amphenol’s cLGA technology in the application of socketed memory for DDR5 and beyond. CAMM solutions are an alternative to traditional DIMM solutions and are gaining strong momentum in the market.

Featured Product: LPCAMM2 Connector Compression Attached Memory Module

 

  • Paladin® HD2 and Active Cable Backplane

Demo showcases multiple products from the Paladin HD2 portfolio and explores active cable solutions to extend the physical reach of backplane topologies.

Featured Products: Paladin® HD2 Backplane Interconnect System

 

  • OSFP1600 and High-Speed IO Passive Copper at 224 Gb/s

Demo features an impressive 224Gb/s passive copper link implementation using Broadcom Custom ASIC SerDes.

Featured Products: OSFP, UltraPass™ OverPass™ Assemblies

 

  • PCIe® Gen7 Interconnect

Demo features a 128 GT/s link running over multiple PCI-SIG® interfaces using Alphawave Semi PCIe® SerDes IP.

Featured Products: PCIe® CEM, Mini Cool Edge IO (MCIO)

 

  • OSFP 2x8 Belly to Belly Liquid-Cooling for Pluggable IO in High-Power AI & ML Applications

Demo features a novel solution for integrating liquid cooling support compatible with traditional data center form factors.

Featured Product: OSFP

 

  • Leak Detection Cable for Liquid-Cooled Datacenters

Demo features a customized sensor solution for monitoring quality and reliability of liquid-cooling implemenations.

Applications In Focus

Immersion-Cooling Data Center Artificial Intelligence High Performance Computing

Paper Presentations at DesignCon 2025

Amphenol’s experts will also be presenting on a variety of different topics at the Conference this year. Check out these sessions to learn more:

Tuesday, January 28

  • Panel – PCI Express & PAM4: Balancing Silicon & Interconnect Interdependencies for 128 GT/S (feat. Multiple industry perspectives and technical experts from the PCI-SIG®)

Wednesday, January 29         

  • Technical Session – Practical Implementation of Insertion Loss Correction & Delay Characterization of Test Fixtures Used for 200Gb/s Per Lane Conformance Testing     
  • Technical Session – Perspectives on Managing Intra-Pair Skew in Copper Cable Assemblies for High-Volume Deployments
  • Lightning Keynote – Amphenol Leading the Evolution of High-Speed Interconnect
  • Amphenol Education Day – Liquid Cooling of I/O Connectors
  • Amphenol Education Day – Cool Express Link EDSFF Gen 6 Pluggable Cable Solution
  • Product Showcase – Cabled Backplane Assemblies
  • Technical Session – Exploring CopprLink & the Future Towards Electro-Optical Interconnects for Evolving Rack Architectures in Data Centers

Thursday, January 30

Technical Session – CAMM: The New Standard for Memory          

  • Panel – Energy Efficient Interfaces for the Next-Generation of AI Compute (feat. Multiple industry perspectives and technical experts from the OIF)
  • Lightning Talk – New Applications in Semiconductor
  • Product Showcase – SSIO PCIe® Gen 6 Product Family
  • Technical Session – It Takes a Village: 224Gb/s Mated Test Fixtures for Compliance

Have a query?

For personalized assistance, please contact our product experts and engineers using the pop-up feature located in the bottom right corner of the page.