The rapid acceleration of technology evolution can be seen in the disruptive products regularly entering the market today.  Advanced datacenters, crypto currency mining, autonomous vehicles, deep learning, and artificial intelligence applications are upending their spaces. Disruptive innovation challenges engineers to develop increasingly integrated designs with enhanced efficiency.

M-Series™ 56 is designed to support these high technology products, in board-to-board or flex assembly architectures, with next-generation differential pair contact design for 56Gb/s NRZ, 112Gb/s PAM-4 performance. Amphenol ICC is a leading innovator in the design, development and high volume manufacturer of Ball Grid Array (BGA) connectors; with industry-leading self-alignment to support applications that require multiple connectors on a single board.    As technology continues to transform industries these performance attributes will support the next-generation product needs in communications (switches, routers, optical), data (servers, storage, and supercomputers), industrial/instrumentation, and consumer products. 

M-Series™ 56 will be on display at DesignCon 2018.  Visit us at booth #833 to learn more on this innovative product and its scope in modern mezzanine architectures.  

Contact your local sales representative or email us at mezzani[email protected] for more details.