Taiwan is getting ready for its biggest global technology exhibition: Computex 2024, which is set to happen from June 4th to 7th at the Taipei Nangang Exhibition Center Halls 1 and 2 in Taipei, Taiwan. Amongst many themes that are relevant to the time, the focus of this year is on the topic “Connecting AI”, the latest global AI technologies, and industry trends. 

As a pioneer in interconnect manufacturing, Amphenol Communications Solutions along with Amphenol Assemble Tech and Amphenol Interconnect Product Corp will be showcasing several innovative connector solutions focusing on AI and ML systems. 

You can find us at Computex 2024 @

  • Booth Number: M1210
  • Date: June 4th to June 7th  
  • Venue: Hall 1, Taipei Nangang Exhibition Center (TaiNEX 1, 4F)

Our latest offerings enable reliable data transmission and seamless connectivity catering to the demands of the ultra-fast data transmission required for AI/ML systems. 

Visitors will also get to learn more on our products from our engineers through engaging demos. We have the following demos on display at Computex this year.

    • A comprehensive demo of OAI2.0 BBU Board Sample
    • A demo showcasing how our 224G GPU link cable solutions and connectors enhance GPU performance.
    • The new high-speed connector system with groundbreaking designs specifically for immersion-cooled data centers.
    • Live demo of 51.2T networking switch showcasing 800Gb/s total solutions, including the onboard connector, DAC cables, and optical transceivers (SiP LPO and EML solutions) 

Amphenol has an array of advanced interconnects designed for AI, ML, and IoT connectivity. Our exhibits this year include high speed solutions like ExaMAX Cable Assembly  and Paladin HD supporting 56Gb/s to 224Gb/s. The ix Industrial™  connectors enable IoT connectivity for Ethernet and other Industrial protocols. Our CDFP cable assemblies are the most reliable PCIe cable solution in the industry designed to meet emerging data center and high-performance computing application needs for high density cabling interconnect systems. We also have the ExtremePort™ QSFP 112G connector that supports next generation 400G applications and transmits up to 112Gb/s PAM4 per channel. The cLGA® Chip-to-Board Socket, Barklip BK450, Hyper Cool Edge system, and 800G QSFP-DD 2*FR4 transceiver are some of the other key exhibits. Apart from this visitors can find an extensive array of high speed, high performing interconnects and our latest products on display. 

Along with Amphenol Communications Solutions, Amphenol Interconnect Product Corp will be displaying a range of products in the series of OCP Rack Power Busbars, Laminate Busbar, over molding Busbar among others. Whereas, Amphenol Assemble Tech will be displaying its range of products like Multi-Trak, , EDSFF Hybrid 1002, NearStack, Mini Cool Edge IO, Extremeport-Swift and others. 

Check out our extensive collection of cutting-edge new additions to AI and ML connector systems to make your projects smarter and efficient than ever before.

Register Now to explore the possibilities of the future with Amphenol. See you at Computex 2024!