The quest for speed, reliability, and innovation is relentless in the ever-evolving landscape of connectivity solutions. As industries race toward the future, the demand for high-speed interconnects capable of handling the data deluge becomes more pressing. At the forefront of this technological frontier stands Amphenol, a pioneer with over nine decades of expertise in crafting cutting-edge connectivity solutions.


Introducing the Next Frontier: 224G High-Speed Interconnects

In today's interconnected world, where data reigns supreme, the need for faster and more efficient communication channels has never been more urgent. Enter 224G high-speed interconnects – the latest evolution in data transmission technology. With data rates reaching an astonishing 224 gigabits per second (Gb/s), these solutions represent a paradigm shift in how we transmit and process information.  These products find extensive use primarily in the data center, the center point of all this information processing and switching.

At Amphenol, we pride ourselves on pushing the boundaries of what's possible, and our team of engineers is leading the charge in developing next-generation 224G interconnects. Through relentless research and development, we're building an ecosystem of high-speed solutions that promise unparalleled performance, reliability, and versatility.

Paladin HD2®: Redefining Performance Beyond 224G

Our Paladin HD2® solution stands as a testament to our commitment to excellence. With its density-optimized design and consistent signal integrity performance, Paladin HD2® is poised to revolutionize high-speed interconnects. Achieving an impressive 144 differential pairs within a 1U orthogonal slot, this solution supports a right angle, direct orthogonal, and cabled configurations.

OverPass™ Cabled Backplane: Extending the Reach of Passive Copper

In the quest for next-generation system designs, our OverPass™ Cabled Backplane solution is leading the way. By extending the reach of passive copper to meet and exceed 224G PAM4 performance, we're enabling our customers to realize their boldest visions for the future of connectivity.

UltraPass™ Internal High-Speed IO: Delivering Unparalleled Performance Near ASICs

Our UltraPass™ Internal High-Speed IO solution offers low-loss arrayed connector layouts for a direct link from chip to pluggable modules, anywhere in the system. With support for signaling speeds of up to 224G, UltraPass™ is the epitome of high-speed, high-density connectivity.

High-Speed Bulk Cables: Setting the Standard for Transmission Speeds

Amphenol's High-Speed Bulk Cables are designed to meet the demands of tomorrow's high-speed applications. With support for transmission speeds of up to 224G, these cables are paving the way for a new era of connectivity.

TR90™ Multicoax Right Angle Connector: Exceptional Signal Integrity up to 90 GHz

Our TR90™ Multicoax Right Angle Connector sets the standard for signal integrity, with exceptional performance up to 90 GHz. Ideal for 112G/224G IC design characterization and validation, this connector is a game-changer in the world of high-speed interconnects.

Substrate Launch Test Fixture (SLTF)

The Substrate Launch Test Fixture (SLTF) is an all-in-one solution for characterizing and validating 112G/224G IC designs. It features a TR Multicoax design integrated with the Ardent SK high-speed socket and lid, offering a compression interface that requires no solder-down components on fragile substrates or silicon.


OSFP1600 is the latest advancement in pluggable optics technology, designed to meet the growing demand for higher bandwidth and faster data transmission rates in data centers. Supporting 8x200 Gb/s host interfaces, it offers a throughput capacity of up to 1600G, surpassing its predecessor, OSFP800.

Key features of OSFP1600 include its integrated heatsink design for superior thermal performance, capable of dissipating over 30 Watts of heat, and full backward compatibility with OSFP800. Additionally, it introduces cabled-connector footprints alongside the traditional surface mount (SMT) connector, enhancing deployment flexibility.

With deployment examples such as 1U and 2U switches supporting 51.2T and 102.4T throughput respectively, OSFP1600 demonstrates scalability and versatility in addressing the needs of modern data center architectures. Overall, OSFP1600 sets a new standard for pluggable optics, offering unmatched performance, reliability, and flexibility in data center networks.


QSFP-DD1600 is a groundbreaking advancement in pluggable optics technology, delivering unprecedented performance in data transmission rates. Operating at 224Gb/s PAM4 signaling per channel, it features an optimized connector footprint ensuring superior signal integrity, with less than 2dB of loss at 53GHz. Utilizing Cadence's leading-edge 224Gb/s-PAM4 Serdes IP, QSFP-DD1600 sets new standards for speed and reliability in high-speed data transmission. This innovation promises to revolutionize data center networks and high-performance computing applications with its unparalleled performance and signal integrity.

Navigating the Road Ahead: Standards and Innovation

As the industry gears up to define 224G standards, Amphenol is committed to driving innovation and supporting our customers every step of the way. With our comprehensive portfolio of solutions and expertise, we're ready to tackle the challenges of tomorrow head-on.

The era of 224G high-speed interconnects is upon us, and Amphenol is leading the charge. With our pioneering solutions and unwavering commitment to excellence, we're shaping the future of connectivity one gigabit at a time. Join us as we embark on this exciting journey into the world of high-speed innovation.