The 2024 OCP Global Summit, scheduled for October 15-17 in San Jose, California, is poised to be a landmark event in the Open Compute community. Under the theme "From Ideas to Impact," the summit will bring together industry leaders, researchers, and innovators. It will be an engaging arena of dynamic discussions and workshops aimed at transforming theoretical concepts into practical solutions. This year’s gathering emphasizes collaboration and innovation, showcasing advancements in open hardware and software that address the evolving needs of data centers.

AMPHENOL @ Booth #C3

Amphenol, a leading global provider of interconnect solutions, is set to participate in the 2024 OCP Global Summit. Amphenol will be showcasing its high-end technology contributing to the Open Compute technology, engaging in dynamic dialogues, conducting demos and interactive sessions. Here is all you need to know about Amphenol’s participation at the event!

Key Highlights of the Event

Innovation Village

The Innovation Village is an engaging platform for attendees to explore cutting-edge innovations within the Open Compute Project community. This year, it features two curated sections: Hands-On Engineering Lab and Future Technologies Symposium.

At the 2024 OCP Global Summit, Amphenol will collaborate with Astera Labs in the Innovation Village, showcasing their commitment to advancing interconnect solutions. Attendees can expect to see Amphenol's latest offerings, including the Multi-Trak, Mini Cool Edge IO, and Hyper Cool Edge cable connectors, which are essential for enhancing data center efficiency and performance.

Product Demos

As part of Amphenol's innovative solutions, the company will be offering product demonstrations in the booth. Amphenol is proud to present a demonstration of liquid cooling cold plate technology on OSFP 1x8 cage and connectors as well as a live demonstration in partnership with Alphawave Semi showing real 112GbE PAM4 traffic running through the EXAMAX2® ARK board-to-board backplane interface while operating fully immersed in immersion cooling fluid.

 

Knowledge Sharing Sessions

 

Another highlight of the 2024 OCP Global Summit will be Amphenol's presentations on various topics.

  1. "Scalable Innovations in Microwave Cabling for Quantum Systems."This session will delve into the advancements in microwave cabling specifically tailored for quantum applications, showcasing how these innovations can enhance the performance and reliability of quantum systems. 
  2. “Implementing PCIe® Connectivity with Optics": This presentation will explore the integration of optical connections in PCIe®  technology, emphasizing the benefits of using light-based solutions to enhance data transfer speeds and reduce latency in high-performance computing environments.
  3. "Steering Copper Architectures: Opportunities for Short-Reach Pluggable Optics": Featured during the OCP Future Technology Initiative, this session will discuss the potential of short-reach optical interfaces to optimize copper architectures, addressing the challenges and opportunities in modern data center connectivity.

Check Out Our Products @ Booth #C3

Amphenol will feature its Paladin® HDExaMAX®, andEXAMAX2® cables at the OCP event, highlighting their high-performance capabilities. The Paladin® HD offers superior signal integrity and high-density design, while the ExaMAX® series boasts low insertion loss and excellent thermal performance. The EXAMAX2® enhances these features with improved electrical performance in a compact form factor.

Amphenol will showcase its highspeed I/O cables like OSFP and QSFP DD cables at the OCP event, emphasizing their high-speed data transmission capabilities. The OSFP cable supports up to 400 Gbps with a compact design, ideal for dense networking environments. Meanwhile, the QSFP DD offers flexibility with support for both 200 Gbps and 400 Gbps configurations, ensuring efficient performance in data centers. There will also be new products like the OSFP-XD, OSFP Liquid Cool, QSFP-DD Liquid Cool on display.

Other new products include on display include: BarKlip® BK220 I/O, BarKlip® nano I/O, 60A AC Input and Cable Assemblies, PwrBlade® ULTRA HD+, and Minitek® Pwr PICPWR Connectors, all of which are leading interconnect solutions for power applications. You can also check out products like Mini Cool Edge, PCIe® Gen 6 and Bus Bar technologies that are sure to turn heads.

These are but a sample of what the Amphenol booth has to offer. For more, visit the Amphenol Booth #C3 on October 15-17, 2024. See you there!