Amphenol’s OverPass^™ cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.

Amphenol’s OverPass^™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC. This enables a simple, low-loss, direct link to pluggable modules or anywhere in the system.  Multiple interface choices are available, so system designers can optimize key parameters like signaling speed, density, and system heat management. 

Low profile, high-density cabling solutions are offered in multiple cable exit options like straight, right angle, and coplanar.  High-speed, low-loss bulk cable from Spectra-Strip^® provides optimized wire performance that aids wire management, termination, and routing.  High-speed solutions are available in 10Gb/s, 28Gb/s, 56Gb/s, 112Gb/s PAM4 per lane signaling speeds.  Cable constructions include double ended, Y, and breakout cables.

Amphenol ICC offers a wide selection of high-speed external interfaces including SFP, QSFP, QSFP DD, OSFP, and cabled backplane interfaces such as ExaMAX® and Paladin®.  An extensive range of internal near chip interfaces include low profile SlimSAS, Mini Cool Edge IO, ExtremePort™ Z-Link and LinkOVER™.  The portfolio also includes cage configurations and layouts such as stacked, ganged and belly-to-belly to maximize the linear board port density available.

Hybrid applications can mix cable and board differential pairs into the same connector, allowing routing of low speed/low reach links through the board, and high speed/high reach links cabled directly to the chip site.  While providing enhanced performance, OverPass™ can lower system costs.  This is done by reducing or eliminating the need for expensive active devices like retimers, and high performance board materials.

Visit Amphenol at DesignCon booth #731, Santa Clara Convention Center to find the ideal solution from Amphenol ICC’s broad range of OverPass^™ connector options.