DesignCon, the largest event for Chip, Board, and Systems Design Engineers, is a three-day engineering event showcasing advanced designs, modern technology updates, and unparalleled networking opportunities for high-speed communications and semiconductor communities.

Amphenol is proud to be the host sponsor for DesignCon 2023 and is looking forward to exhibiting and meeting with both current and new customers. The event will be taking place at the Santa Clara Convention Center in Santa Clara, California from Jan 31st through February 2nd, 2023. Amphenol will have an extensive array of interconnect solutions and exciting product demonstrations on display, including 224G, Automotive Ethernet, Thermal Management Solutions, and more in booth #833 at the event.  Here are a few of our key demonstrations that will be at DesignCon:

Multi-Gigabit Automotive Ethernet

Amphenol will be demonstrating a Multi-Gigabit Automotive Ethernet Camera Development Module powered by Axonne’s Cyton™ PHY. Amphenol’s Ve-NET™ header is affixed on the camera module and our Ve-NET™ high-speed multi-gigabit Ethernet cable assembly connects the TX board to the RX board to display the source screen and the transmitted screen.

PCIe Gen6 ft. MCIO, Multi-Track, CEM

Together with Keysight Technologies, Amphenol cascades test fixtures using ISI boards that represent host routing and device packaging through a 3-connector topology to develop and demonstrate a 64GT/s PCIe Gen6 link.

OSFP and OSFP-XD Thermal Demo

The Amphenol booth will also have a thermal management and airflow demonstration with Multilane on a 2RU high network switch chassis routed with 16xOSFP800 ports and 8xOSFP-XD ports. The 51.2T chassis will be air-cooled by standard fans with adjustable speed and stressed by thermal load modules with adjustable power.

Amphenol’s experts will be happy to meet with you at Booth #833 to discuss solutions to solve your challenges.

Click here to register for the event now.  We hope to see you there a DesignCon!