As the final day of the event is approaching, here is a sneak peek in our Data and Communications showcase at Electronica 2018.

Cool Edge

Cool Edge is a high speed and high power board to board connector system addressing multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z. It is offered in different configurations like mezzanine, coplanar, midplane and backplane, making it suitable for applications in data and communication such as S [Read more]

The countdown for one of the world’s largest and leading electronics fair has begun. Messe München will gather members, visitors, and exhibitors from the electronics industry around the globe from 13 to 16 November. Electronica opens a vast platform for experts to exchange ideas, see the latest innovations and share information with suppliers from all around the world. 

Communication and networking is an ever growing industry. The transformation from one generation to the next has been relentless. 1G technology was analog cellular, 2G used technologies like CDMA, GSM, and TDM to make the first giant leap towards digital communications. The speed concepts were reframed from Kbps to few Mbps with the introduction of 3G technologies like EVDO, HSPA, and UMTS. 

SSD form factors are constantly improving to meet the enhanced application demands. We previously discussed the earlier and existing SSD form factors like U.2, PCIe-based AIC, mSATA, mPCIe, and M.2. However, with the advancements in technology, its high time to prepare for next-generation SSDs. 

Different connector manufacturers within an industry develop their own electrical components for a wide range of applications. Even when product specifications remain the same, there are differences in the quality, size, shape, and materials used, thus, affecting application designs and architectures. Industry standards are defined to clear these discrepancies. These are rules and regulations made by a consortium of similar-minded industrialists to bring a unified approach to carry out severa [Read more]