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Tag Archives: Flash Memory Summit

Amphenol Connect Blog

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Meet Us at Flash Memory Summit (FMS) 2023

Meet Us at Flash Memory Summit (FMS) 2023

Amphenol is excited to announce its participation in the Flash Memory Summit (FMS) 2023 Conference & Expo. As a prominent player in the memory and storage industry, Amphenol recognizes the importance of being part of this premier international showcase. Here are some of the products Amphenol will be showcasing at FMS from August 8 - 10, 2023 at the Santa Clara Convention Center in Santa Clara, California. [Read more]
 Visit Us at Flash Memory Summit 2022

Visit Us at Flash Memory Summit 2022

The Flash Memory Summit in Santa Clara is the largest event for flash memory and other high-speed memory technologies. The event brings together exhibitors from various sectors including design and components in non-volatile memory technologies and consumer electronics around the globe [Read more]
Amphenol at Virtual Flash Memory Summit (FMS) 2020

Amphenol at Virtual Flash Memory Summit (FMS) 2020

Flash Memory Summit (FMS), the world’s premiere flash memory conference and exposition brings together storage designers, integrators, and IT storage professionals from around the world to create the most competitive, high-performance storage solutions. Amphenol is proud to be the part of the Virtual FMS this year, taking place from November 10th to 12th 2020.

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Meet Us at Flash Memory Summit 2019

Meet Us at Flash Memory Summit 2019

Flash Memory Summit is one of the greatest platforms for all industries associated with flash memory and its applications. This year, the event will take place at Santa Clara Convention Center, CA from 6th to 8th of August 2019.  The Summit theme this year includes Flash Memory Based Architectures, PCIe/NVMe, SSDs Solid State Drives (SSDs), Enterprise Applications and Storage, Controllers, persistent memory, new non-volatile memory technologies, standards, testing, and applications.

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Mini Cool Edge IO – The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System

Mini Cool Edge IO – The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System

The development of Big Data, IoT, 5G, and other high-end applications requires signal transmission speed to a istorical high. The most common signal transmission medium – Printed Circuit Board, has limitations in high-speed environments. Due to the natural characteristic of common PCB materials, severe signal distortion happens through signal route and form a serious barrier in system design, thus obstructing the development of high-end applications. 

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