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Board to Board | Mezzanine

Amphenol has led the industry in the development and manufacturing of high-performance mezzanine interconnect systems for over 20 years.

Our business specializes in high-speed, high-density interconnection solutions to solve next generation application problems. We bring product innovation and solutions to application problems where space is limited, operating speeds are high, and reliability is a must. We also recognize that the right timing is as important as the right product. We have the technology to handle difficult applications and we can get the right solution to you quickly.

As bandwidth demands increase, the challenge is to achieve higher performance at the lowest possible system costs. With a broad range of packaging solutions, we can help tackle this challenge head-on in the earliest stages of your design cycle.

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  1. DensiStak™ 1034 pin Open-Pin-Field Board-to-Board Connector
    DensiStak™ 1034 pin Open-Pin-Field Board-to-Board Connector
    HIGH DENSITY / HIGH SPEED / DUAL-BEAM CONTACT / USCAR-2 COMPLIANT BOARD-TO-BOARD CONNECTOR Amphenol FCI...
    DETAILS
  2. COM-HPC
    COM-HPC 0.635mm pitch 400 pin Open-Pin-Field Array
    400POS 0.635MM PITCH COM-HPC Amphenol has developed a pair of 400pos 0.635mm COM-HPC which support 5mm...
    DETAILS
  3. BergStak HS™ 0.50mm Mezzanine Connector
    BergStak HS™ 0.50mm Mezzanine Connector
    FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS Amphenol's FCI Basics BergStak HS™ connector...
    DETAILS
  4. ICFP (IC Footprint Probe)
    ICFP (IC Footprint Probe)
    Fast Signal Path Probing for Integrated Circuit Footprints Amphenol's ICFP offers 50 Ohms access...
    DETAILS
  5. M-Series™ VR 56Gb/s PAM4 BGA Mezzanine Connector
    M-Series™ VR 56Gb/s PAM4 BGA Mezzanine Connector
    56GB/S HIGH SPEED MEZZANINE BGA CONNECTOR SYSTEM Leveraging proven technologies, including an industry-leading...
    DETAILS
  6. cLGA® Chip-to-Board Socket
    cLGA® Chip-to-Board Socket
    HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION The Amphenol cLGA® land grid array...
    DETAILS
  7. M-Series
    M-Series™ 112Gb/s PAM4 BGA Mezzanine Connector
    56GB/S-112GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM Leveraging well-established technologies,...
    DETAILS
  8. cStack™ 25Gb/s Compression-mount Mezzanine Interposer
    cStack™ 25Gb/s Compression-mount Mezzanine Interposer
    CUSTOMIZABLE SOLDERLESS INTERPOSER-BASED ONE-PIECE STACKER The Amphenol cStack™ high speed solder-less...
    DETAILS
  9. SK Series Chip-to-Board Socket
    SK Series Chip-to-Board Socket
    High Performance Compression Mount Sockets Amphenol's patented compression mount contact technology...
    DETAILS
  10. CA Series™ 32Gb/s Compression-mount Interposer
    CA Series™ 32Gb/s Compression-mount Interposer
    32Gb/s+ Compression Mount Connectors and Interposers Amphenol's CA Series™ high performance...
    DETAILS
  11. Lynx™ 25Gb/s Low Profile, High Density Open-Pin-Field Connector
    Lynx™ 25Gb/s Low Profile, High Density Open-Pin-Field Connector
    HIGH SPEED AND DOUBLE DENSITY LOW-PROFILE BOARD-TO-BOARD CONNECTOR Amphenol's Lynx™...
    DETAILS
  12. Lynx™ QD 56Gb/s PCIe® Gen 5 Differential Signaling Connector
    Lynx™ QD 56Gb/s PCIe® Gen 5 Differential Signaling Connector
    THE QUAD DIFFERENTIAL SOLUTION Optimized for differential pair signaling, Lynx™ QD sets a new...
    DETAILS
  13. MEG-ARRAY
    MEG-Array® 32Gb/s High Density BGA Connector
    INDUSTRY-PROVEN BGA ARRAY CONNECTOR The MEG-Array ® Mezzanine Connector system provides...
    DETAILS
  14. Chameleon® 25G+ High Density Open Pin-Field Array
    Chameleon® 25G+ High Density Open Pin-Field Array
    ADAPT AND ADVANCE TO THE NEXT GENERATION With performance speeds up to 25 Gbps+, Chameleon meets the...
    DETAILS
  15. Examezz
    ExaMEZZ® 56Gb/s High Speed, Hermaphroditic BGA Mezzanine Connector
    INNOVATIVE 56G "PINLESS" STACKER FROM Amphenol The ExaMEZZ® connector system...
    DETAILS
  16. InfinX® 25G+ High Density BGA Mezzanine Connector
    InfinX® 25G+ High Density BGA Mezzanine Connector
    OPTIMIZED FOR PERFORMANCE AND DIFFERENTAIL PAIR SIGNALING The InfinX® high-speed mezzanine...
    DETAILS
  17. NeXLev® 12.5Gb/s High Density BGA Mezzanine Connector
    NeXLev® 12.5Gb/s High Density BGA Mezzanine Connector
    MARKET PROVEN HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR Amphenol's NeXLev®...
    DETAILS
  18. Conan® Lite 1.00mm Connector
    Conan® Lite 1.00mm Connector
    A SECURE, HIGH SPEED AND RELIABLE BOARD-TO-BOARD SOLUTION Conan® Lite 1.00mm connectors...
    DETAILS
  19. Millipacs® Mezzanine
    Millipacs® Mezzanine
    2.00MM MODULAR MEZZANINE INTERCONNECTION SYSTEM FCI Basics Millipacs® Vertical header...
    DETAILS
  20. BergStak HS™ 0.80mm Board-to-Board Connector
    BergStak HS™ 0.80mm Board-to-Board Connector
    FLEXIBLE SOLUTION FOR HIGH SPEED APPLICATION FCI Basics BergStak HS™ connector family is known...
    DETAILS
  21. BergStak® 0.80mm Shielded Board-to-Board Connector
    BergStak® 0.80mm Shielded Board-to-Board Connector
    RELIABLE, HIGH-SPEED SHIELDED CONNECTORS FCI Basics BergStak® 0.80mm connector family...
    DETAILS
  22. BergStak+™ 0.80mm Mezzanine Connector
    BergStak+™ 0.80mm Mezzanine Connector
    BOARD-TO-BOARD SOLUTION FOR HIGH SPEED AND HIGH-DENSITY APPLICATIONS BergStak+...
    DETAILS
  23. BergStak® 0.80mm Pitch
    BergStak® 0.80mm Pitch
    FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FCI Basics BergStak® 0.8mm is a flexible...
    DETAILS
  24. BergStak® Lite 0.80mm Board-to-Board Connector
    BergStak® Lite 0.80mm Board-to-Board Connector
    ECONOMICAL OPTION FOR HIGH-DENSITY APPLICATIONS Amphenol's BergStak® Lite 0.8mm is...
    DETAILS
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