• SMT Connectors

    Our portfolio of SMT connectors provides the flexibility, density, and high speed interconnection your next generation designs require.

  • Compression Technology

    Our compression portfolio represents low cost, high signal integrity, high reliability next generation chip-to-board, board-to-board, and flex-to-board interconnection technology.

  • Flexible Circuits &
    Customized Solutions

    Our flexible circuit design capabilities provide limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.

  • Smallest, Fastest, Efficient
    Compression Mount Technology

    Our high performance multicoax and coaxial assemblies, connectors, and sockets are used in the development of next generation semiconductors and electronics systems.

ABOUT Mezzanine

Amphenol has led the industry in the development and manufacturing of high-performance mezzanine interconnect systems for over 20 years.


Formerly known as Amphenol Intercon Systems, our mezzanine business specializes in high-speed, high-density interconnection solutions to solve next generation application problems. We bring product innovation and solutions to application problems where space is limited, operating speeds are high, and reliability is a must. We also recognize that the right timing is as important as the right product. We have the technology to handle difficult applications and we can get the right solution to you quickly.


As bandwidth demands increase, the challenge is to achieve higher performance at the lowest possible system costs. With a broad range of packaging solutions, we can help tackle this challenge head-on in the earliest stages of your design cycle.


The Amphenol Mezzanine portfolio offers a wide range of SMT connectors - ranging in mated stack heights from 4mm to 42mm - to meet your board-to-board application requirements, especially when high density and high speed are paramount.

M-Series

M-Series™

56GB/S-112GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM Leveraging well-established technologies, including an industry-leading Ball Grid Array (BGA)...
Lynx™ QD

Lynx™ QD

THE QUAD DIFFERENTIAL SOLUTION Optimized for differential pair signaling, Lynx™ QD sets a new standard for density and flexibility that offers...
Chameleon®

Chameleon®

ADAPT AND ADVANCE TO THE NEXT GENERATION With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller and more compact connector...
Lynx™

Lynx™

HIGH SPEED AND DOUBLE DENSITY LOW-PROFILE BOARD-TO-BOARD CONNECTOR Amphenol's Lynx™ is a 4-row product offering doubling the density...
NeXLev®

NeXLev®

MARKET PROVEN HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR Amphenol's NeXLev® is an established and proven high-density parallel board-to-board...
GIG-Array®

GIG-Array®

HIGH-DENSITY BGA ARRAY CONNECTOR Amphenol's GIG-Array® connectors are designed to meet the needs of applications up to 10Gb/s requiring...
MEG-ARRAY

MEG-Array®

INDUSTRY-PROVEN BGA ARRAY CONNECTOR The MEG-Array ® Mezzanine Connector system provides the high density and high-speed benefits of a large array...
InfinX®

InfinX®

OPTIMIZED FOR PERFORMANCE AND DIFFERENTAIL PAIR SIGNALING The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s...

Amphenol’s cLGA® land grid array socket system brings conventional connector material construction to a high-performance, low-cost socket design. Millions of cLGA sockets are in use worldwide in demanding applications ranging from handheld consumer products to supercomputer systems.

cLGA®

cLGA®

HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION The Amphenol cLGA® land grid array socket system was designed to bring conventional connector...
cStack™

cStack™

CUSTOMIZABLE SOLDERLESS INTERPOSER-BASED ONE-PIECE STACKER The Amphenol cStack™ high speed solder-less interconnect solution provides limitless...

Amphenol has the capability to customize flexible circuit assemblies to create a wide array of interconnect solutions. We provide application support from the initial flex design through the customized hardware design to create a total system solution.

cStack™ Flex Cables

cStack™ Flex Cables

INTERPOSER-BASED FLEX ASSEMBLY FOR BOARD-TO-BOARD APPLICATIONS Amphenol's cStack™ flexible circuit assemblies are designed for applications...
Custom Flex Cables

Custom Flex Cables

Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol...

Amphenol Ardent Concepts focuses on helping bring next generation computing to novel connector designs for test & measurement, OEM applications, and specialized military applications.

CA Series - Connectors

CA Series - Connectors

32Gb/s+ Compression Mount Connectors and Interposers Amphenol's CA Series™ high performance 32 Gb/s+ compression mount connectors & interposers...
TR Multicoax

TR Multicoax

Highest Density High Speed Coax Connector TR Multicoax delivers superior signal integrity from multiple high speed analog or digital channels. With...
SK Series - Sockets

SK Series - Sockets

High Performance Compression Mount Sockets Amphenol's patented compression mount contact technology utilizes industry-leading alloys to make cost...
ICFP

ICFP

Fast Signal Path Probing for Integrated Circuit Footprints Amphenol's ICFP offers 50 Ohms access to IC contact pads and signal paths on an IC circuit...