Get your sample by choosing part number(s) from the product page or using the search box above.
Manually add part number(s) here
OverPass™
High Speed Bulk Cables
OverPass™
External IO
The OverPass cable assembly portfolio is enhanced using Amphenol Spectra-Strip’s high frequency SkewClear EXD cable technology and manufacturing expertise.
- Offerings include multi-pair cables: 2, 4 and 8 pair constructions in wire gages from 32 AWG to 26 AWG
- All feature FEP insulated wiring for the higher temperature environments that OverPass products can be exposed to while minimizing associated signal loss
- They support transmission speeds of 10G, 28G, 56G, 112G, and 224G PAM 4 per lane bandwidths
- Spectra-Strip engineers work closely with their Amphenol IO connector counterparts assuring our customers the lowest total applied interconnect link cost for their OverPass cable assembly applications
SkewClear® EXD™ Gen 2 (2 extrusion)
Two insulated cores encapsulated in a secondary insulation, shielded longitudinally
- Closely coupled conductors reduce wire mode conversion
- Foam insulated cores possible to extend reach / density
- Longest reach links away from high heat sources (<85°C)
- Twinax geometry optimized for maximum reach and density for OSFP, Paladin HD2, and UltraPass
Compatibility Roadmap
- 112G
- Compatible with ExaMAX2, DensiLink, micro-LinkOver, QSFP-DD, OSFP and Paladin on longest reaches
- 224G
- Compatible with ExaMAX2, Paladin HD2, OSFP, and UltraPass on longest reach
SkewClear® EXD™ Gen 2 (1 extrusion)
Two conductors encapsulated in a single insulation, shielded longitudinally
- Closely coupled conductors reduce wire mode conversion
- Customizable profiles possible
- High performance near chip applications
- Twinax geometry optimized for maximum reach and density for OSFP, Paladin HD2, and UltraPass
Compatibility Roadmap
- 112G
- Compatible with ExaMAX2, DensiLink, micro-LinkOver, QSFP-DD, OSFP and Paladin on longest reaches
- 224G
- Compatible with ExaMAX2, Paladin HD2, UltraPass, and OSFP
SkewClear® EXD™ Gen 2+
Two conductors encapsulated in a single insulation, shielded longitudinally
- Cu Shield improves losses ~10%
- Improved thermal stability in high temperature applications
- Closely coupled conductors reduce wire mode conversion
- Customizable profiles possible
- Designed for high performance near chip applications
Compatibility Roadmap
- 112G
- Compatible with ExaMAX2, DensiLink, micro-LinkOver, QSFP-DD, OSFP and Paladin on longest reaches
- 224G
- Compatible with ExaMAX2, Paladin HD2, UltraPass, and OSFP