AgilLink™ 0.8mm Wire-to-Board

Overview
Click Image to Enlarge
Overview
Documentation
Documentation
Description
Read More
Features & Benefits
FEATURES BENEFITS
  • 0.8mm pitch wire to board solution
  • Low profile feature can save the space
  • Various mounting options including vertical SMT, right angle SMT
  • Ease in choosing board mating configurations
  • High temperature thermoplastic material
  • Re-flow compatible
  • Tape and reel packaging option
  • Supports PiP process
  • Mates with WTB G855H/G855C
  • Mutually compatible for wire-to-board
  • RoHS compliance and halogen-free
  • Meets environmental, health and safety requirements
Target Markets & Applications