AgilLink™ 1.25mm Wire-to-Board

Overview
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Overview
Documentation
Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • 1.5mm pitch Wire to Board
  • Save device space
  • Various mounting options including vertical DIP, right angle DIP, vertical SMT and right angle SMT
  • Ease in choosing board mating configurations
  • High temperature thermoplastic material
  • Re-flow compatible
  • Tape and reel packaging option
  • Supports PiP process
  • Latch design
  • Ease for Mating and unmating
  • Mates with Header WTB G880, G878 H/C & G884H/C
  • Mutually compatible for wire-to-board
  • RoHS compliance and halogen-free
  • Meets environmental, health and safety requirements
Part Numbers
Target Markets & Applications