AgilLink™ 2.54mm Wire-to-Board

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FEATURES	BENEFITS
Flexible and easy to change pin length	Application and design flexibility
Various mounting options including vertical DIP, right angle DIP, vertical SMT and right angle SMT	Ease in choosing board mating configurations
High temperature thermoplastic material	Re-flow compatible
Tape and reel packaging option	Supports PiP process
G888 mating with G55H/C, G861AB and G861AD	Mutually compatible for wire-to-board
RoHS compliance and halogen-free	Meets environmental, health and safety requirements

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