HIGH SPEED HARDMETRIC CONNECTOR SUPPORTING ORTHOGONAL CONFIGURATION
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s. System architects may now customize and assign their highest speed signals to the orthogonal pins while routing other signals through the standard AirMax VS® backplane connectors. This additional capability offers yet another level of increased system design flexibility.
Data Rate: 20Gb/s
4-Pair x 4-Pair orthogonal mid-plane solution
Offers design flexibility to system architects
Innovative shieldless design and airless dielectric
HIGH SPEED HARDMETRIC CONNECTOR SUPPORTING ORTHOGONAL CONFIGURATION
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s. System architects may now customize and assign their highest speed signals to the orthogonal pins while routing other signals through the standard AirMax VS® backplane connectors. This additional capability offers yet another level of increased system design flexibility.
Data Rate: 20Gb/s
4-Pair x 4-Pair orthogonal mid-plane solution
Offers design flexibility to system architects
Innovative shieldless design and airless dielectric
Features & Benefits
FEATURES
BENEFITS
Enables orthogonal mid-plane system architecture
Provides a direct high speed connection while eliminating traces on the mid-plane
Provide capability to support 16 differential pair crossovers in a single module
Highly dense solution
Headers install back-to-back and at 90° to each other
Helps to directly connect vertical line cards with horizontal switch or communication cards
Header signal pins share vias to provide a direct connection, eliminating the need for connecting traces
Reduces PCB costs
Halogen-free products
Aid efforts to minimize the use of environmentally sensitive materials in the electronics industry
Use the same power and guide modules as backplane or mid-plane applications