AirMax VS^® High-Speed Backplane Connector

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FEATURES	BENEFITS
Innovative shieldless design and air dielectric between adjacent conductors	Reduces cost, improves flexibility and delivers low insertion loss and crosstalk
Open Pin Field Design	Provides flexibility to use pins for differential or single-ended signals, ground or power
Available in modules with 3-, 4-, or 5-Pairs per column and 6, 8, or 10 columns per module in addition to 85Ohms versions	Enables system configuration using common, off-the-shelf modules, and simplifies design, supply chain management, inventory, and scheduling
Backward mating-compatible interface	Allows designers to choose the right combination for any specific system using common components, reducing cost and lead times
AirMax signal, power, and guidance modules in stock at most distributors	Assurance of supply, short lead times, and competitive pricing all reduce risk to the OEM and contract manufacturers
Available with headers or receptacles on the backplane	Reduces connector cost, weight, and PCB routing complexity
Adopted by multiple industry standard architectures, including Storage Bridge Bay and Serial CPCI	Standard configuration and part numbers accelerate your design and reduce risk
3mm pitch AirMax VS^® modules allow 2 pairs between columns	Reduces the layer count for both boards by up to 50%, saving system cost and improving performance

AirMax VS® High-Speed Backplane Connector