BarKlip^® BK600 I/O

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Description

OCP-COMPATIBLE POWER CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE

Amphenol's BarKlip^® BK600 I/O power cable assemblies feature an OCP-compatible design compliant with ORv3 power distribution architecture standards. Barklip^® BK600 I/O can distribute up to 700A between busbars, cables, and circuit boards. Designed similar to other ORv3 busbar connectors, the BK600 I/O provides best-in class current carrying capability featuring silver plated contacts ensuring low contact resistance, ultrasonically welded cables for high reliability, and secondary chassis grounding contacts providing grounding functionality for improved safety. BarKlip^® BK600 I/O's high current carrying capabilities and customizable design are ideal for data center applications such as power shelves (PSUs), battery backup units (BBU's), server/ storage sleds, and high-density system architecture powering Artificial Intelligence (AI).

Distributes up to 700A per contact.
Supports 48V Power Rack Architecture.
Fully compliant with ORv3 Power Output Specifications.
Features chassis grounding contacts.
Ultra-low end-of-life contact resistance of 0.05mΩ.

Features & Benefits

FEATURES	BENEFITS
Contacts with high conductivity copper alloy	Carries up to 700A/Contact (45°C/300LFM airflow)
Ultrasonically welded between wire and contact	Low voltage drop and high reliability
22 independent conducting beams and silver plating	Ultra-low end-of-life contact resistance of 0.05mΩ
Secondary chassis grounding contacts	Provides additional grounding functionality for safety
New, longer contact design	Maximizes contact wipe with ORv3 laminated busbar (6mm thick)
Floating panel mount design	Supports ±3mm float horizontally and vertically

BarKlip® BK600 I/O

BarKlip® BK600 I/O

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Overview

Overview

Documentation

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Description

Features & Benefits

Target Markets & Applications

BarKlip^® BK600 I/O

BarKlip^® BK600 I/O