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  • BergStak® 0.80mm Pitch

BergStak® 0.80mm Pitch

BergStak® 0.80mm Pitch

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Overview
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Description

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FCI Basics BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.

Housing and terminal profile guarantees support of up to 12Gb/s

Vertical versus vertical mating configuration

40 to 200 position sizes in 20 position increments

5mm to 20mm stack heights in 1mm increments

Features & Benefits
FEATURES BENEFITS
  • Housing and terminal profile guarantees support of up to 12Gb/s
  • Compatible with PCIe Gen 2/3 and SAS 3.0 high-speed performance on selected stack heights
  • Vertical versus vertical mating configuration
  • Suitable for parallel board stacking applications
  • 40 to 200 position sizes in 20 position increments
  • 5mm to 20mm stack heights in 1mm increments
  • Comprehensive range of sizes and stack heights to satisfy all needs
  • 0.8mm double-row contact pitch conserves printed circuit board space
  • High density for all electrical applications needs
  • Scoop-proof feature housings
  • Prevents reverse mating
  • Multiple plating options available
  • Supports diverse applications
  • Multiple packaging options available
  • Suitable for varies feeding processes
  • PCB locator pegs option
  • Facilitates ease and accuracy during manual assembly
  • Available in UL94-V0 material
  • High flammability rating
  • RoHS compliant and lead-free
  • Meets environmental, health and safety requirements
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