BergStik^® 2.54mm - Unshrouded Headers - Vertical - Through Mount/Surface Mount

Click Image to Enlarge

FEATURES	BENEFITS
High temperature thermoplastic material	Reflow compatible
Variable spacing height for stacking headers	Cater to a wide range of applications
Allow dual entry; mating from top or bottom	Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
Blank 0.64mm square contacts presents 4 surfaces of equal quality	Can be used for wire wrapping
Standoff design	Allows cleaning to remove soldering contamination
Duplex plating	Cost-efficient
Tin-lead plating in press-fit area	Easy pin insertion onto PCB
Retention legs option	High retention force onto PCB
Press-fit designed to fit 1.02mm diameter hole, solder-toboard product	Same layout on THT and press-fit
Meets DIN 41651 specification, HE13 and BT D2632	Qualified product

BergStik® 2.54mm - Unshrouded Headers - Vertical - Through Mount/Surface Mount