COM-HPC

Overview
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Overview
Documentation
Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Higher bandwidth up to 32Gb/s per channel
  • To give an extra-long application life cycle without data transfer rates as bottle necks
  • The design gives CPU power support at 150W
  • It can handle boards that need to consume higher power
  • Support full DIMMs up to 8
  • The form factor is designed to handle the latest Intel Core processors with up to one terabyte of memory via eight DIMM sockets
  • Higher pin counts
  • To address HPC server application for more pin-out requirement
  • The connector pairs can withstand 100G Mechanical Shock
  • Allows applications in the critical working environment
  • High un-mating force
  • Ensures secure connection
  • RoHS compliant and lead-free
  • Meets environmental, health, and safety requirements
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Target Markets & Applications