COM-HPC

Documentation Coming Soon.

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Documentation Coming Soon.

FEATURES	BENEFITS
Higher bandwidth up to 32Gbs per channel	Gives an extra-long application life cycle without data transfer rates as bottlenecks
Gives CPU power support at 150W	Can handle boards that need to consume higher power
Supports full DIMMs up to 8	The form factor is designed to handle the latest Intel Core processors with up to one terabyte of memory via 8 DIMM sockets
Higher pin counts	Addresses HPC server application for more pin-out requirements

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