COM-HPC 0.635mm pitch 400 pin Open-Pin-Field Array

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FEATURES	BENEFITS
Higher bandwidth up to 32Gb/s per channel	To give an extra-long application life cycle without data transfer rates as bottle necks
The design gives CPU power support at 150W	It can handle boards that need to consume higher power
Support full DIMMs up to 8	The form factor is designed to handle the latest Intel Core processors with up to one terabyte of memory via eight DIMM sockets
Higher pin counts	To address HPC server application for more pin-out requirement
The connector pairs can withstand 100G Mechanical Shock	Allows applications in the critical working environment
High un-mating force	Ensures secure connection
RoHS compliant and lead-free	Meets environmental, health, and safety requirements

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