cStack™ Flex Cables

Overview
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Overview
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Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Three-dimensional interconnect
  • Enables unique packaging solutions not available with other technologies and can be routed over and around obstacles to conserve space and maximize airflow
  • Polyimide flex material
  • Lower signal loss and better temperature stability than FR4
  • cStack interposer employs compression termination which allows lower mated height
  • Lower mated height at 1.22mm offering superior performance
  • Multiple impedance values available
  • Can be optimized to meet a wide range of SI requirements
  • Thinner, lighter and of higher density than wired cables or rigid boards
  • Reduces space and weight
  • Multilayer construction with three or more copper layers
  • Optimizes routing, impedance and SI performance
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