cStack™ 25Gb/s Compression-mount Mezzanine Interposer

CUSTOMIZABLE SOLDERLESS INTERPOSER-BASED ONE-PIECE STACKER

The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.

With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and reliability are required.

The cStack™ product family includes board-to-board or flex-circuit-to-board stacking connectors. In these product applications, the cStack™ connector is a low cost, high signal integrity alternative to standard two piece connectors.

• Data Rate: 25Gb/s
• Conserves space and maximizes airflow
• Compression termination allows lower mated height
• Allow FPC or BTB stacking