D-Sub High Density Board-Mount Connectors

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Documentation

D Sub Brochure
Datasheet - D Sub High Density
D-Sub Overview
Product Presentation
Product Specification - High Density - GS-12-350
Product Specification - Compact-D R/A PiP - GS-12-607

Overview Part Numbers Configure Your Product Choose Your Configuration Target Markets & Applications

Overview

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Overview

Documentation

D Sub Brochure
Datasheet - D Sub High Density
D-Sub Overview
Product Presentation
Product Specification - High Density - GS-12-350
Product Specification - Compact-D R/A PiP - GS-12-607

Description

PERIPHERAL I/O CONNECTORS UP TO 78 POSITIONS

Amphenol's D-Sub High Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes. Coupled with backplane, board-to-board, and cable connections, the connectors pave way to total solution for equipment designs. The products are UL recognized and lead-free.

Positions from 15 to 78
Compact-D design
Available in Press-fit and Pin-in-Paste terminations

Features & Benefits

FEATURES	BENEFITS
D-shaped shell design	Enables polarization
Accommodates larger number of contacts in the basic shell sizes	High contact density
Various PCB mounting and panel mounting accessory options	Allows for design flexibility
Offers standard and higher performance durability ratings	Application flexibility
Lead-Free and RoHS compliant	Meets environmental, health and safety requirements

Part Numbers

USA
EU
ASIA