D-Sub Pin-in-Paste Connectors

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FEATURES	BENEFITS
Has a D-shaped shell design	Enables polarization
PiP technology is derived from the solder-to-board design for robustness	Cost-effective solution compared to SMT technology
User Through-hole Reflow technology for soldering	Avoids traditional wave soldering
Tape and reel packaging allows automated pick-and-place process	Saves time
PiP technology unlike wave soldering does not need constant adjustment and is thus more stable	Enhances product quality
Similar PCB layouts and hole diameters	Avoids any board re-designs
Usage of through hole pins and metal pegs compared to SMT	Provides higher robustness
Lead-Free and RoHS compliant	Meets environmental, health and safety requirements

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