DensiLink® OverPass™ Assemblies

Overview

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Overview

Documentation
Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Direct point-to-point connection; hi-density two piece IO connector & cable system
  • Significant reduction in signal loss transmission; addresses system thermal and mechanical needs
  • SMT or SMT / through hole leg board connector mounting
  • Robust connector mounting & reliability
  • Full support of 56G & 112G signaling speeds and anticipated 224G
  • Full signal integrity performance compatibility
  • Straightforward application & termination; pick-n-place board connector & guided cable mating
  • Ease of assembly into hardware systems
  • 100% full performance testing and characterization
  • Assures full product functionality
  • Full vertical integration of product components
  • Connectors and cable supplied, processed, terminated and tested by Amphenol
  • 16 differential pair configuration; 32 pair in development
  • Choice of multiple IO solutions to address differential pair count and performance
  • Pairs with QSFP DD or QSFP OverPass™ interfaces to deliver high performance, high speed external Ethernet IO port products
  • Fully engineered and vertically integrated 8 channel assembly solutions for 56G, 112G and future 224G signaling systems
  • Eliminates the need for re-timers and expensive low loss PCB laminates
  • Lowers system costs

Target Markets & Applications