DensiStak™ Board-to-Board Connector

Overview
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Overview
Description

HIGH DENSITY / HIGH SPEED / DUAL-BEAM CONTACT / USCAR-2 COMPLIANT BOARD-TO-BOARD CONNECTOR

Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields.

  • High Density upto 1034 pos
  • High Speed, upto PCIe® Gen 4 with 16Gb/s
  • Dual-Beam Contact system
  • Compact size
  • USCAR-2 compliant
Features & Benefits
FEATURES BENEFITS
  • High Density 11-Row 1000+ positions
  • Provides solution to connect with chips with high speed, low speed and power needs
  • High speed performance up to 16Gb/s
  • Meets PCIe® Gen 4, Ethernet, USB, DP, and MIPI protocols
  • Dual-beam contact system
  • Reliable design
  • Compact design with 0.80mm in X direction and 1.25mm in Y direction
  • Saves board space
  • USCAR-2 compliant
  • Supports automotive application
  • Open-Pin-Field Design
  • Design flexibility
  • Surface mount soldering tails
  • Makes customer soldering easy
  • RoHS compliant, halogen and lead-free
  • Meets health, safety and environment requirements
  • UL94V-0 high temperature material
  • With-stand harsh environment
Part Numbers
Target Markets & Applications