Amphenol's sockets for DLP^® products are interconnect solutions for the Texas Instruments DLP^® chips suitable for ultra-mobile and portable applications. TI's DLP technology leads the industry in display and advanced light control solutions. Amphenol's high density, cost effective cLGA and cStack solutions provide both a heat-sink opening and features for precise alignment of the interposers to the DMD and main PC Board. Use the documentation to the right to find the socket for the DMD for which you are designing.

For more information, please visit http://www.ti.com/dlp-chip/overview.html