NEXT-GENERATION NEAR CHIP HIGH SPEED SOLUTION - UP TO 56G PAM4
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extreme low profile design capable of transmitting high-speed signal up to 56G PAM4, and allows much greater signal path lengths, while maintaining SI performance when compared to conventional PCB routing methods.
ExtremePort™ Flash not only provides a SI performance ready signal transmission but also a new way of system design that is cost-effective, highly modular, scalable, and extremely easy to repair.
High speed - 56Gb/s PAM4 Capability
Extremely low profile that provide high speed transmission under the condition of extreme mechanical space limitation
NEXT-GENERATION NEAR CHIP HIGH SPEED SOLUTION - UP TO 56G PAM4
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extreme low profile design capable of transmitting high-speed signal up to 56G PAM4, and allows much greater signal path lengths, while maintaining SI performance when compared to conventional PCB routing methods.
ExtremePort™ Flash not only provides a SI performance ready signal transmission but also a new way of system design that is cost-effective, highly modular, scalable, and extremely easy to repair.
High speed - 56Gb/s PAM4 Capability
Extremely low profile that provide high speed transmission under the condition of extreme mechanical space limitation
Features & Benefits
FEATURES
BENEFITS
0.60mm pitch right angle configuration, with 4.50mm height for dual row
Extreme low profile for extreme mechanical space limitation
Up to 56Gb/s PAM4, over 1.0 meter transmission distance
Extends transmission range far more over the conventional PCB routes
Supports both cable and card edge applications with one identical connector
Provides flexibility in system design to meet highly modular, scalable and easy-to-repair requirements
Meets PCIe®/NVMe/SAS/SFP(+)/QSFP specifications
Saves system material cost, engineering and certification expenses with high succession of system design