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Features & Benefits
  • RoHS compliant
  • Environmental friendly
  • Optimized design for utilization in high-density, high-speed mezzanine applications
  • Market-proven and trusted, high-performance solution
  • Ball Grid Array (BGA) termination
  • Provides a process-friendly attachment experience
  • 1mm x 0.65mm BGA interface pitch
  • Optimizes routing and electrical performance
  • Stack heights available from 15mm to 40mm
  • Provides mechanical design flexibility
  • Connector sizes of 104, 200 and 296 signals providing 62 signal contacts per linear cm (158 signal contacts per linear inch)
  • Allow for optimization of board space and signal requirements
  • 100Ω differential pair matched the impedance
  • Assures consistent highspeed performance
  • Dual beam signal contacts provide two points of contact
  • Increases product reliability
  • Polarized design
  • Ensures proper mating of the connector
Target Markets & Applications