The HCI^® High Power backplane/midplane connector series addresses applications demanding additional power at the interface between a daughter card and a backplane or midplane in chassis-based equipment platforms. The compact modules leverage proven, cost-effective stamped-andformed HCI power contact technology to provide increased linear power density along the daughter card edge. In addition to conventional 1x2 and 1x3 power contact configurations, a 2-position module is available with an integrated guide between the power contacts.

HCI High Power modules are rated for up to 113A per contact without exceeding a 30°C temperature rise in still air. The modules address applications where current density requirements extend beyond those of Amphenol's established Hard Metric High Power Connector System.

These stand-alone modules are designed for use alongside other Hard Metric (HM) backplane/midplane connector families such as Amphenol's high-performance AirMax VS^® and ZipLine^™ connector systems or Millipacs^® 2mm HM connectors. In fact, ZipLine and HCI High Power together offer the highest combination of signal and power density in the marketplace.

Individual power contacts are surrounded on four sides by molded housing walls to provide a distinct safety feature that prevents adjacent power contacts from shorting. The touchproof housings are designed to optimize airflow around and through the connector by providing vents above and below the power contacts as well as along the rear of the housing. A 2x2 right-angle receptacle extends use to co-planar applications when used with a 1x2 or 2x2 right-angle header.