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HD Express®

HD Express®

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Overview
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Overview
Documentation
Documentation
Description

PCIE® GEN 6 BACKPLANE INTERCONNECT SYSTEM

The HD Express® is a high-density, high-performance interconnect system designed to meet and exceed PCIe® Gen 6 electrical and mechanical requirements for high-end 85Ω architectures.

  • PCIe® Gen 6
  • Price and performance scalability
  • Modular construction with integrated guidance
  • Highest density
  • 85Ω impedance
Features & Benefits
FEATURES BENEFITS
  • 85Ω impedance
  • Specifically designed to support PCIe® Gen 6 links
  • Ground structure on all 4 sides of the mating beams of each differential pair
  • Provides high signal isolation performance
  • Highest density
  • Highest density backplane product in the market
  • Scalable design
  • Single Wafer design utilizing traditional design elements
  • 13.8 Mil Drill-Compliant Pin
  • Proven press-fit technology
  • Beam on blade
  • Provides a complete solution for customer's unique requirements
  • Press-fit
  • For additional margin and overall system cost savings
  • Die-cast guide module
  • Robust guidance features integrated into the connector design
Target Markets & Applications