ICFP (IC Footprint Probe)

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Description

Fast Signal Path Probing for Integrated Circuit Footprints

Amphenol's ICFP offers 50 Ohms access to IC contact pads and signal paths on an IC circuit footprint. This solution is a simple to manipulate, cost effective and time saving alternative to expensive X-Y tables and fragile planar probes for Engineers who may need to probe multiple signals at once. With ICFP technology, test engineers and reference design engineers can implement the shortest and fastest, compression mount connector technology to probe multiple signals simultaneously.

Less expensive and more robust than planar probes
Comes with strain relief support
Durability of 1000+ mechanical cycles

For more information, please visit www.ardentconcepts.com

Features & Benefits

FEATURES	BENEFITS
40GHz+ bandwidth	Superior signal integrity
Guided alignment feature	Quicker and easier probing
Available in 0.8mm and 1.0mm pitches	Suits industry standard IC packages
Compression mount interface	Allows design flexibility
Pure vertical interface	No offset required
No breaking of fragile planar probes	Allows Cost Savings