InfinX®

Overview

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Overview

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Description
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Features & Benefits
FEATURES BENEFITS
  • Supports performance from 10Gb/s to 25+Gb/s
  • Provides multiple data rate options and a migration path for future applications
  • Offers the highest differential pair density available
  • Unmatched density, optimized for differential performance with low crosstalk and signal loss
  • Available in stack heights from 10mm to 42mm and in multiple module sizes
  • Provides great flexibility to designers with stringent board-to-board requirements
  • Utilizes Amphenol ICC's patented Resonance Dampening technology
  • Provides the highest level of signal fidelity to mezzanine connectors in the industry
  • "Blade-in-Ball" BGA attachment
  • Minimizes effects of component tolerances and improves SMT board assembly yields

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Target Markets & Applications