M-Series™ 112Gb/s PAM4 BGA Mezzanine Connector

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Documentation

Datasheet
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Overview

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Overview

Documentation

Datasheet
Product Specification
App Specification

Description

56GB/S-112GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM

Leveraging well-established technologies, including an industry-leading Ball Grid Array (BGA) design, this connector offers a superior self-aligning and self-leveling solution. It incorporates a next-generation differential pair contact design, enabling exceptional performance of up to 56Gb/s NRZ and 112Gb/s PAM4.

High density, high speed, dual-point contacts
Self-aligning/leveling for multiple connector use
1.6mm column to column pitch
56Gb/s NRZ and 112Gb/s PAM4 performance
Stack Heights: 4mm & 5mm

Features & Benefits

FEATURES	BENEFITS
22+ year old solder joint reliability per IPC-SM-785	Quality and Reliability
Industry-leading self-alignment	Supports multiple connector applications
Integrated pin protection on receptacle connector	Durable mating interface design eliminates bent pins
Proven contact mating beam geometries with 2-point contact	Reliable peformance through shock and vibration

Part Numbers

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