- High density, high speed, discrete contact, array connector in the revolutionary BGA platform
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- Legacy market-proven and trusted solution
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- Flexible ground distribution
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- Optimized for high-speed signal integrityÂ
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- 32Gb/s differential pair performance documented for 4mm and 6mm stack height
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- Scalable, high data rates
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- Online s-parameter files and signal integrity performance reports
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- Improves design accuracy and time-to-market
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- 1.27mm x 1.27mm grid provides 71 contacts per cm2 density
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- Dual-point, long wipe contacts
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- Choice of six stack heights from 4mm to 14mm and choice of eight sizes from 81 to 528 positions
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- The wide range of sizes and PCB stack heights increase mechanical design flexibilityÂ
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- High-density standard BGA attachment
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- Â Lowers assembly costs by using standard SMT processesÂ
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- BGA features natural surface tension property
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- Â Provides self-alignment and self-leveling for multiple connector usagesÂ
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- Patented BGA contact attachment
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- Â Preserves solder ball positioningÂ
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- Enhances electrical performance
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- Qualifies Telcordia GR-1217-CORE and NPS-25298-2 optionsÂ
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- Time-tested reliability record
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- 22+-year-old solder joint reliability per IPC-SM-785Â
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- Â Long-term reliability assurance from quality organizations
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- 17 Billion+ lines shipped
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- Has a long track record of customer satisfaction
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- Precious metal plating options
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- Satisfies varying customer needs for environmental resistance
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