micro-LinkOVER™ OverPass™ Assemblies

HIGH SPEED CABLES SUPPORTING 56G AND 112G SIGNALING
micro-LinkOVER™ OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect by overpassing the PCB. These cables support 56G and 112G signaling in hardware system designs as well as a technology for future 224G signaling systems. Deploying these cables can result in lower over signal loss, less PCB design complexity and reduced PCB costs. The low profile of the connector allows for mounting of the connector end under the chip's heat sink.

These cable assemblies lower system costs by eliminating the need for re-timers and expensive low loss PCB laminates. They also enable arrayed connector layouts for near chip / on package IO solutions allowing cascaded cable routing and high differential pair count interconnection near or around the chip site.

• Removes the high speed signaling from the PCB
• Creates an eight channel lower loss interconnection from the chip site to the external port
• Enables 56G and 112G hardware system design
• Reduced overall system cost
• Enables arrayed connector layouts for near chip / on package IO solutions
• Delivers superior signal integrity performance