micro-LinkOVER™ OverPass™ Assemblies

Overview

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Overview

Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Direct point-to-point connection; single connector compression connection to PCB
  • Significant reduction in signal loss transmission; addresses system thermal and mechanical needs
  • SMT or screw hold down mounting options
  • Robust connector mounting & reliability
  • Direct wire attachment to connector contact & robust shield termination coupled with high performance differential pair cabling
  • Delivers superior signal integrity performance; short signal length from cable to board pad
  • Full support of 56G & 112G signaling speeds and anticipated 224G
  • Full signal integrity performance compatibility
  • Straightforward application & termination; alignment pins assure proper connector location
  • Ease of assembly into hardware systems
  • 100% full performance testing and characterization
  • Assures full product functionality
  • Full vertical integration of product components
  • Connectors and cable supplied, processed, terminated & tested by Amphenol
  • 16 & 24 differential pair configurations
  • Choice of multiple IO solutions to address differential pair count and performance

Target Markets & Applications