micro-LinkOVER™ Above PCB Connector System

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Description

Cutting-Edge-Near-Chip Termination in Amphenol's OverPass Portfolio
micro-LinkOVER™ is an above PCB twinaxial connector system that provides system designers and layout engineers a cost effective approach to unlock the design flexibility needed to manage the technical challenges of PAM4 56G and 112G systems and beyond. Supporting data rates from 10G to more than 112G PAM4 per lane with high signal-to-noise ratio and low VSWR. micro-LinkOVER's direct to PCB compression mount solution eliminates the need for any lossy paddle cards, minimizing transitions and losses on system budgets. Its modular design allows for multiple form factors in dense footprints to fit in crowded real estate environments. micro-LinkOVER is an ideal solution for 100G/200G/400G Systems, lnfiniband™, PCle^®, Chip-to-Chip links, and 5G systems.

Performance up to 112G+ PAM4 per lane (demonstrated 100G baud per lane)
Signal-to-noise performance of >30dB of insertion loss to crosstalk at 50GHz
Eliminates complicated and lossy trace routing
Designed specifically for differential pairs/routing
Extremely short trace routing from IC to connector

Features & Benefits

FEATURES	BENEFITS
Utilizes Ardent's patented compression mount contacts	Performance up to 112G+ PAM4 per lane (demonstrated 100G baud per lane) Signal-to-noise performance of >30dB of Insertion Loss to Crosstalk at 50 GHz
SKEWCLEAR^® drainless parallel pair twinax	Eliminates complicated and lossy trace routing Designed specifically for differential pairs/routing
High density footprint with 2.40mm pitch (cable)	Extremely short trace routing from IC to connector
Passive copper connector system	Lowers power requirements significantly compared to optical engines