Millipacs^® High Temperature Backplane Connectors

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Documentation

Datasheet
Industrial Backplane connector solutions for Diverse Applications

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Overview

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Overview

Documentation

Datasheet
Industrial Backplane connector solutions for Diverse Applications

Description

COMPATIBLE FOR HIGH TEMPERATURE APPLICATIONS

Amphenol's Millipacs^® is a 2.00mm grid Interconnection system in hard metric configuration designed in accordance to IEC 917, IEC 61076-4-101, Telecordia GR-1217-CORE standards and fulfills Compact PCI bus architecture.

Millipacs^® high temperature series addresses the market requirements for Backplane connectors compatible for higher operating temperature applications. With growing density and electronics packaging, temperature rise is posing challenges to the users. Besides standard operating temperature range of -55°C to +125°C, options for extended temperature range of -65°C to +175°C and smoke and fire compliant standard EN45545 is available.

As one of the most popular Backplane connector series, Millipacs^® is feature-packed for rugged environments. Features like two-beam twisted tulip contact, header pin length choice for hot swapping, EMI shielding, coding, guiding, high operating temperature make it ideal for use in rugged and reliable applications in multiple market segments.

Smoke and fire compliant EN45545 version
Extended High Temperature capacity range from -65°C to 175°C
Option for Enhanced Current rating up to 3 A per pin or standard 1.5A per pin.
Data rates options up to 25 Gbps and Hybrid Power up to 40A per pin
Hot Swapping and EMI Protection

Features & Benefits

FEATURES	BENEFITS
EN45545-2 certified: fire and smoke compliant	Suitable for railway applications
Thermal absorption and withstanding capability up to -65°C to +175°C	Saves process cost and suitability for higher temperature applications
Enhanced current rating per signal pin up to 3A max.	Lower temperature rise
Receptacle contact - tulip type	Equalized signal path and contact reliability
Press fit and Pin-in-Paste tail options	High temperature with reflow capable housing and Pin-in-Paste soldering allows for transition to reflow PCB assembly
FMLB and LMFB	Hot swapping and direct plugging
Top and bottom shielding options	EMI Protection
RoHS compliant and lead-free	Meets environmental, health and safety requirements

Millipacs® High Temperature Backplane Connectors