MiniStak High Density High Speed 0.6mm Board-to-Board Connector

Overview
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Overview
Documentation
Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Higher bandwidth up to PCIe Gen5 SI with road map to PCIe Gen6
  • To give an extra-long application life cycle without data transfer rates as bottlenecks
  • Fine pitch of 0.60mm
  • To allow smaller PCB estate area
  • Scalable pin count from 40pos to 400pos at the incremental of 40pos with road map up to 1000pos.
  • To accommodate a variety of design and application needs
  • Three stack height variations
  • Provide feasibility of stack height to cater to different applications
  • Operating current rating at 0.5A per signal contact and 1.1A per power contact (with 24 contacts energized)
  • Allows high current application by energizing more pins
  • RoHS compliant and lead-free
  • Meets environmental, health, and safety requirements
  • The connector pairs can withstand 50G mechanical shock
  • Allows applications in the critical working environment
Target Markets & Applications