OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK350 I/O power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 360A per contact between busbars, cables, and circuit boards. The BK350 I/O design includes individual power circuits, secondary chassis ground contacts that provide supplemental grounding for system fault protection, and sense contacts that enable hot-swap circuitry for connector and system protection. Additionally, BK350 I/O features Amphenol's proprietary GCS® silver-based plating technology, which ensures best-in-class current carrying capabilities, and ultra-low end-of-life contact resistance of 0.05mΩ. With its high current capacity and modular design, the BK350 I/O is ideal for a variety of emerging Data Center applications, including AI/ML servers, Storage Sleds, and Power Shelves.
Distributes up to 360A per contact
Ultra-low end-of-life contact resistance of 0.05mΩ
Floating panel mount design supports ± 3mm by ± 1.9mm horizontal and vertical
Fully compliant Orv3 IT Gear Power Input Solution specifications
Secondary chassis grounding contacts redirects fluctuating electricity and provides supplemental grounding to the rack for system fault protection
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK350 I/O power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 360A per contact between busbars, cables, and circuit boards. The BK350 I/O design includes individual power circuits, secondary chassis ground contacts that provide supplemental grounding for system fault protection, and sense contacts that enable hot-swap circuitry for connector and system protection. Additionally, BK350 I/O features Amphenol's proprietary GCS® silver-based plating technology, which ensures best-in-class current carrying capabilities, and ultra-low end-of-life contact resistance of 0.05mΩ. With its high current capacity and modular design, the BK350 I/O is ideal for a variety of emerging Data Center applications, including AI/ML servers, Storage Sleds, and Power Shelves.
Distributes up to 360A per contact
Ultra-low end-of-life contact resistance of 0.05mΩ
Floating panel mount design supports ± 3mm by ± 1.9mm horizontal and vertical
Fully compliant Orv3 IT Gear Power Input Solution specifications
Secondary chassis grounding contacts redirects fluctuating electricity and provides supplemental grounding to the rack for system fault protection
Features & Benefits
FEATURES
BENEFITS
Contacts with high-conductivity Copper Alloy
Carries up to 360A per contact
18 Independent conducting beams and silver-based plating
Permits ultra-low end-of-life contact resistance of 0.05mΩ
Floating panel mount design
Supports ± 3mm by ± 1.9mm horizontal and vertical
Sense pin contacts
Enables mate last-first break capability
Secondary chassis grounding contacts
Safely provides supplemental grounding to the rack for system fault protection
Ultrasonically welded between the wire and the contact