OSFP OverPass™ Assemblies

DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT
OSFP OverPass™ products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external OSFP IO port by overpassing the PCB. This helps to enable 56G and 112G hardware system designs and a technology for future 224G systems. Using these solutions results in lower over signal loss, less PCB design complexity and reduces PCB costs. Fully compatible with OSFP industry standards and with both high speed and sideband signal requirements.

These cable assemblies lower system costs by eliminating the need for re-timers and expensive low loss PCB laminates. They can be paired with multiple near chip IO solutions including Amphenol's micro-LinkOVER™ and DensiLink^® with press-fit sidebands or cabled sidebands to a separate Minitek^® cable connector.

• Lower loss interconnect from chip site to external port
• Enables 56G and 112G hardware system design
• Superior signal integrity performance
• Fully engineered and tested cabling solution with straightforward application and assembly into systems