Paladin® HD 112G Backplane Interconnect System

Overview
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Overview
Description
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Features & Benefits
FEATURES BENEFITS
  • World class orthogonal density
  • 144 differential pairs within 1RU card spacing
  • Industry standard performance for 112Gb/s channels
  • More than 40dB IL to XTalk margin at Nyquist
  • Linear transmission beyond 40GHz
  • No stub resonances through 40GHz
  • Revolutionary hybrid board attachment: compression mount signals and press-fit grounds
  • Optimized for SI performance, density, routing, repairability, and manufacturability
  • Maximized routing channels to minimize board layers
  • 144 differential pair orthogonal can route in 6 high speed layers, up to 2 pairs per layer
  • Consistent Signal Integrity performance over the connector's mechanical mating range
  • Under 5Ω of impedance change and minimal crosstalk impact while the connector is de-mated up to 1.50mm
  • Mechanically matched and electrically balanced signals within each differential pair
  • Skew-less design with low mode conversion with conventional trace breakout
  • Common and symmetrical mating interface
  • Supports Orthogonal applications in both 90°/ 270° along with male and female cable
  • Mate and footprint compatible with Paladin® HD2 and leverages proven Paladin® differential pair architecture
  • Mate compatible upgrade path from 112Gb/s to 224Gb/s with reliable and robust design features
  • All system architectures supported; cables can terminate to other Amphenol product lines
  • Board-to-board, board-to-cable, and cable-to-cable applications supported, including internal overpass
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Target Markets & Applications