Paladin^® HD 112G Backplane Interconnect System

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FEATURES	BENEFITS
World class orthogonal density	144 diff pairs within 1RU card spacing, including room for airflow
Industry standard performance for 112G systems	More than 40dB IL to XTalk margin at 25GHz
Linear transmission beyond 40GHz	No stub resonances out to 40GHz
Hybrid board attachment with press fit grounds and compression mount signals allow for traditional manufacturing processes	Optimized for maximum pair to pair density, signal integrity performance, and differential pair routing access at top layers of the board
Maximized routing channels to minimize board layers	144 diff pair orthogonal can route in 6 high speed layers, up to 2 pairs per layer
Consistent Signal Integrity performance over the connector's mechanical mating range	Less than 5Ω of impedance change while the connector is de-mated up to 1.5mm
Mechanically matched and electrically balanced signals within each differential pair	Skew-less design with low mode conversion with conventional trace breakout
Common and symmetrical mating interface	Supports Orthogonal applications in both 90° / 270°, along with male and female cable
Leverages proven Paladin differential pair architecture and mating interface	Optimized reliability, robustness, quality, and real world 112G applications
92Ω nominal impedance +/- 5Ω	Future upgrades under design

Paladin® HD 112G Backplane Interconnect System